公开(公告)号：EP1886412A4

公开(公告)日：2009-07-08

申请号：EP06760686

申请日：2006-06-05

Applicant: IBM

Inventor： CHEN ZHI NING ,  LIU DUIXIAN ,  PFEIFFER ULLRICH R ,  ZWICK THOMAS M

IPC: H04B1/28 ,  H01Q1/22

CPC classification number: H01Q1/22 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01Q1/2283 ,  H01L2924/00

Abstract: Apparatus and methods are provided for integrally packaging semiconductor IC (integrated circuit) chips and antenna devices which are integrally constructed from package frame structures (e.g., lead frame, package carrier, package core, etc.), to thereby form compact integrated radio/wireless communications systems for millimeter wave applications. For example, an electronic apparatus (30) includes a package frame (11) having an antenna (12) that is integrally formed as part of the package frame (11), an IC (integrated circuit) chip (13) mounted to the package frame (11), interconnects (19) that provide electrical connections to the IC chip (13) and the antenna (12), and a package cover (15).

公开(公告)号：WO2006133108A3

公开(公告)日：2007-11-29

申请号：PCT/US2006021770

申请日：2006-06-05

Applicant: IBM ,  CHEN ZHI NING ,  LIU DUIXIAN ,  PFEIFFER ULLRICH R ,  ZWICK THOMAS M

Inventor： CHEN ZHI NING ,  LIU DUIXIAN ,  PFEIFFER ULLRICH R ,  ZWICK THOMAS M

IPC: H04B1/28

CPC classification number: H01Q1/22 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01Q1/2283 ,  H01L2924/00

Abstract: Apparatus and methods are provided for integrally packaging semiconductor IC (integrated circuit) chips and antenna devices which are integrally constructed from package frame structures (e.g., lead frame, package carrier, package core, etc.), to thereby form compact integrated radio/wireless communications systems for millimeter wave applications. For example, an electronic apparatus (30) includes a package frame (11) having an antenna (12) that is integrally formed as part of the package frame (11), an IC (integrated circuit) chip (13) mounted to the package frame (11), interconnects (19) that provide electrical connections to the IC chip (13) and the antenna (12), and a package cover (15).

Abstract translation: 提供了用于整体封装由封装框架结构（例如，引线框架，封装载体，封装芯等）整体构建的半导体IC（集成电路）芯片和天线装置的集成封装，从而形成紧凑的集成无线电/无线 通信系统用于毫米波应用。 例如，电子设备（30）包括具有整体形成为封装框架（11）的一部分的天线（12）的封装框架（11），安装在封装框架（11）上的IC（集成电路）芯片 框架（11），提供到IC芯片（13）和天线（12）的电连接的互连（19）和封装盖（15）。