Abstract:
PROBLEM TO BE SOLVED: To provide a CMOS-compatible integrated dielectric optical waveguide coupler, and to provide an apparatus for fabrication thereof. SOLUTION: Integrated circuits are fabricated with an integral optical coupling transition to efficiently couple optical energy from an optical fiber to an integrated optical waveguide on the integrated circuit. Layers of specific materials are deposited onto a semiconductor circuit to support etching of a trench to receive an optical coupler that performs proper impedance matching between an optical fiber and an on-circuit optical waveguide that extends part way into the transition channel. A silicon based dielectric that includes at least a portion with a refractive index substantially equal to a section of the optical fiber is deposited into the etched trench to create the optical coupler. Silicon-based dielectrics with graded indices are also able to be used. Chemical mechanical polishing is used to finalize preparation of the optical transition and integrated circuit. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a CMOS compatible integrated dielectric optical waveguide coupler and a fabrication method therefor. SOLUTION: An optoelectronic circuit fabrication method and an integrated circuit manufacturing apparatus fabricated therewith are provided. Integrated circuits are fabricated with an integral optical coupling transition to efficiently couple optical energy from an optical fiber to an integrated optical waveguide on the integrated circuit. Layers of specific materials are deposited onto a semiconductor circuit to support etching of a trench to receive an optical coupler that performs proper impedance matching between an optical fiber and an on-circuit optical waveguide that extends part way into the transition channel. A silicon based dielectric that includes at least a portion with an refractive index substantially equal to a section of the optical fiber is deposited into the etched trench to create the optical coupler. Silicon based dielectrics with graded indices are also able to be used. Chemical mechanical polishing is used to finalize preparation of the optical transition and integrated circuit. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To eliminate the reflection of the boundary surface between a resist and an ARC and to drastically improve CD control by making an adjustment for conforming to the optical characteristics of a substrate, and make it useful as a bottom antireflection coating. SOLUTION: A plasma reinforced chemical vapor phase adhesion device 8, used for adhering an amorphous carbon film, includes a reaction chamber 10 and has a throttle valve 11 for isolating the reaction chamber 10 from a vacuum pump. A cathode 19 is electrically connected to an adjustable high-frequency power supply 14, and the impedance between the cathode 19 and the high-frequency power supply 14 is matched by a matching box 13. An amorphous carbon film coating changes the optical constant of the film by changing the process parameters, thus minimizing a reflection factor on the boundary surface between the resist and the substrate and reducing a swing ratio.