公开(公告)号：DE2647758A1

公开(公告)日：1977-05-05

申请号：DE2647758

申请日：1976-10-22

Applicant: IBM

Inventor： CHU RICHARD CHAO-SAN ,  GUPTA OMKARNATH RAMNATH ,  HWANG UN-PAH ,  SIMONS ROBERT EDWARD

IPC: F25D9/00 ,  G12B15/02 ,  H01L23/373 ,  H01L23/42 ,  H01L23/433 ,  H01L23/44 ,  H01L23/473 ,  H05K7/20 ,  H01L23/34

Abstract: A gas encapsulated cooling unit is provided for one or more heat generating components mounted on a substrate. A heat conductive cap is sealed to the substrate enclosing the heat generating components. The wall of the cap opposite the substrate contains elongated openings therein extending towards the heat generating components and on the same centers with respect thereto. A resilient member is located in the cap in communion with the inner end of the openings. A thermal conductive element is located in each of the openings forming a small peripheral gap between each opening wall and the associated thermal conductive element. The resilient member urges the thermal conductive elements into pressure contact with the heat generating components. A thermal conductive inert gas is located within the cap filling the peripheral gaps and the interfaces between the heat generating elements and the thermal conductive elements. The heat is removed from the cap by external heat removal means.

公开(公告)号：FR2393425A1

公开(公告)日：1978-12-29

申请号：FR7813279

申请日：1978-04-27

Applicant: IBM

Inventor： CHU RICHARD CHAO-SAN ,  EATON JAMES H ,  MEAGHER RALPH E

IPC: F28F13/00 ,  H01L23/367 ,  H01L23/433 ,  H01L23/473 ,  H01L25/04 ,  H01L25/18 ,  H01L23/34 ,  F28D21/00

Abstract: A conduction heat transfer connection is made between a heat source and a heat sink which is flexible so as to adapt to variations in distance between the source and sink and which maintains the required force on the heat source to obtain the required heat transfer across the junction therebetween. The connection consists of a heat conductive metallic foil bundle of sufficient thickness to contact sufficient surface area of the heat source to provide the required heat transfer and of sufficient thinness to be flexible enough to absorb the expansion and contraction due to temperature changes as well as the differences in distance between the heat source and sink and of sufficient length to contact at or near the other end thereof the heat sink.

公开(公告)号：DE2823296A1

公开(公告)日：1978-12-14

申请号：DE2823296

申请日：1978-05-27

Applicant: IBM

Inventor： CHU RICHARD CHAO-SAN ,  EATON JAMES HOWARD ,  MEAGHER RALPH ERNEST

IPC: F28F13/00 ,  H01L23/367 ,  H01L23/433 ,  H01L23/473 ,  H01L25/04 ,  H01L25/18 ,  H01L23/36

Abstract: A conduction heat transfer connection is made between a heat source and a heat sink which is flexible so as to adapt to variations in distance between the source and sink and which maintains the required force on the heat source to obtain the required heat transfer across the junction therebetween. The connection consists of a heat conductive metallic foil bundle of sufficient thickness to contact sufficient surface area of the heat source to provide the required heat transfer and of sufficient thinness to be flexible enough to absorb the expansion and contraction due to temperature changes as well as the differences in distance between the heat source and sink and of sufficient length to contact at or near the other end thereof the heat sink.