公开(公告)号：DE2823296A1

公开(公告)日：1978-12-14

申请号：DE2823296

申请日：1978-05-27

Applicant: IBM

Inventor： CHU RICHARD CHAO-SAN ,  EATON JAMES HOWARD ,  MEAGHER RALPH ERNEST

IPC: F28F13/00 ,  H01L23/367 ,  H01L23/433 ,  H01L23/473 ,  H01L25/04 ,  H01L25/18 ,  H01L23/36

Abstract: A conduction heat transfer connection is made between a heat source and a heat sink which is flexible so as to adapt to variations in distance between the source and sink and which maintains the required force on the heat source to obtain the required heat transfer across the junction therebetween. The connection consists of a heat conductive metallic foil bundle of sufficient thickness to contact sufficient surface area of the heat source to provide the required heat transfer and of sufficient thinness to be flexible enough to absorb the expansion and contraction due to temperature changes as well as the differences in distance between the heat source and sink and of sufficient length to contact at or near the other end thereof the heat sink.