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公开(公告)号：DE3673850D1
公开(公告)日：1990-10-11
申请号：DE3673850
申请日：1986-04-04
Applicant: IBM
Inventor： CHURCHWELL ROBERT WILLIAM , FLAITZ PHILIP LEE , HUMENIK JAMES NOEL
Abstract: A method for use in brazing an interconnect pin to a portion of metallization pattern (e.g. a pad) existing on a brittle dielectric substrate, such as a multi-layered ceramic (MLC) substrate, is disclosed.
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