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公开(公告)号：DE69005961T2
公开(公告)日：1994-06-23
申请号：DE69005961
申请日：1990-06-01
Applicant: IBM
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Patent Agency Ranking
公开(公告)号：DE3673850D1
公开(公告)日：1990-10-11
申请号：DE3673850
申请日：1986-04-04
Applicant: IBM
Inventor： CHURCHWELL ROBERT WILLIAM , FLAITZ PHILIP LEE , HUMENIK JAMES NOEL
Abstract: A method for use in brazing an interconnect pin to a portion of metallization pattern (e.g. a pad) existing on a brittle dielectric substrate, such as a multi-layered ceramic (MLC) substrate, is disclosed.
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公开(公告)号：DE2833144A1
公开(公告)日：1979-02-22
申请号：DE2833144
申请日：1978-07-28
Applicant: IBM
Inventor： HUMENIK JAMES NOEL , POWELL JIMMIE LEE , TUMMALA RAO RAMAMOHANA
IPC: B41J2/135 , B41J2/16 , C03C3/076 , C03C3/087 , C03C3/089 , C03C3/091 , C03C4/20 , C03C3/30 , C03C3/04 , C03C3/14 , B41J3/04
Abstract: The lifetime of multiple capillary nozzle assemblies embedded in a glass mass, of a multiple nozzle ink-jet printer, can be increased and the thermal and mechanical compatibility of the resulting package enhanced by fabrication of the nozzles from glass compositions comprised of SiO2, ZrO2, Na2O, K2O and MgO. Inclusion of ZrO2 as well as minor amounts of BaO, MgO, CaO, and Al2O3 enhances the alkali resistance of the glass nozzles. Also, the high SiO2 content of the glasses combined with the presence of ZrO2, MgO, CaO, and Al2O3 imparts an acid resistance to the nozzles.
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公开(公告)号：DE68923717T2
公开(公告)日：1996-04-18
申请号：DE68923717
申请日：1989-02-28
Applicant: IBM
Inventor： BAISE ARNOLD IVAN , CASEY JON ALFRED , CLARKE DAVID RICHARD , DIVAKARUNI RENUKA SHASTRI , DUNKEL WERNER ERNEST , HUMENIK JAMES NOEL , KANDETZKE STEVEN MICHAEL , KIRBY DANIEL PATRICK , KNICKERBOCKER JOHN ULRICH , MATTS AMY TRESTMAN , TAKACS MARK ANTHONY , WIGGINS LOVELL BERRY
IPC: H05K1/03 , C04B41/48 , C04B41/49 , H01L21/48 , H01L23/08 , H01L23/538 , H05K3/40 , H01L23/15 , H01L23/52
Abstract: The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks (33) with a flexible material (35). Uniform gaps between the metal (32) and dielectric materials (31) can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.
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公开(公告)号：DE68923717D1
公开(公告)日：1995-09-14
申请号：DE68923717
申请日：1989-02-28
Applicant: IBM
Inventor： BAISE ARNOLD IVAN , CASEY JON ALFRED , CLARKE DAVID RICHARD , DIVAKARUNI RENUKA SHASTRI , DUNKEL WERNER ERNEST , HUMENIK JAMES NOEL , KANDETZKE STEVEN MICHAEL , KIRBY DANIEL PATRICK , KNICKERBOCKER JOHN ULRICH , MATTS AMY TRESTMAN , TAKACS MARK ANTHONY , WIGGINS LOVELL BERRY
IPC: H05K1/03 , C04B41/48 , C04B41/49 , H01L21/48 , H01L23/08 , H01L23/538 , H05K3/40 , H01L23/15 , H01L23/52
Abstract: The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks (33) with a flexible material (35). Uniform gaps between the metal (32) and dielectric materials (31) can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.
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公开(公告)号：DE69005961D1
公开(公告)日：1994-02-24
申请号：DE69005961
申请日：1990-06-01
Applicant: IBM
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