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公开(公告)号：EP0277118A4
公开(公告)日：1988-11-24
申请号：EP86905127
申请日：1986-08-19
Applicant: IBM
Inventor： CIBULSKY MICHAEL J
CPC classification number: C25D5/02 , H05K1/117 , H05K3/046 , H05K3/242 , H05K2201/09727 , H05K2203/0195 , H05K2203/175
Abstract: Method for use in the manufacture of printed circuit boards (1) wherein the conductive circuit (3) placed on a dielectric substrate (2) includes a commoning portion (4) which electrically connects selected portions (5) of the printed circuit (3) which will subsequently be electroplated. The commoning portion (4) of the printed circuit (3) is peeled away from the substrate (2) after the selected portions (5) of the printed circuit are electroplated, leaving the electroplated portions (5) electrically separated, except as they might be otherwise electrically connected through other paths in the printed circuit board (1).
Abstract translation: 一种用于制造印刷电路板（1）的方法，其中放置在介电基板（2）上的导电电路（3）包括将印刷电路（3）的选定部分（5）电连接的共用部分（4） 随后将被电镀。 在印刷电路的选定部分（5）被电镀之后，印刷电路（3）的共用部分（4）从基板（2）剥离，留下电镀部分（5） 否则通过印刷电路板（1）中的其他路径电连接。
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公开(公告)号：DE69112157T2
公开(公告)日：1996-04-18
申请号：DE69112157
申请日：1991-06-08
Applicant: IBM
Inventor： CIBULSKY MICHAEL J , PAPATHOMAS KOSTAS , SCHMITT GEORGE P
Abstract: A dicyandiamide crosslinked epoxy prepreg substantially free from dicyandiamide crystals is obtained by subjecting an epoxy composition containing dicyandiamide to elevated temperature to thereby form a substantially prereacted product, adding solvents if desired, desolvating, and then thermally advancing the prereacted product to the desired state of crosslinking to thereby form the prepreg.
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公开(公告)号：ES2003233A6
公开(公告)日：1988-10-16
申请号：ES8700476
申请日：1987-02-24
Applicant: IBM
Inventor： CIBULSKY MICHAEL J
Abstract: SE PROPORCIONA UN METODO PARA SU USO EN LA FABRICACION DE PLACAS (1) DE CIRCUITOS IMPRESOS, EN DONDE EL CIRCUITO CONDUCTOR (3) SITUADO SOBRE UN SUSTRATO DIELECTRICO (2) INCLUYE UNA PARTE (4) DE CONEXION COMUN QUE CONECTA ELECTRICAMENTE PARTES SELECCIONADAS (5) DEL CIRCUITO IMPRESO (3) QUE SERAN ELECTRODEPOSITADAS POSTERIORMENTE. LA PARTE (4) DE CONEXION COMUN DEL CIRCUITO IMPRESO (3) ES DESPRENDIDA DEL SUSTRATO (2) DESPUES DE QUE SON ELECTRODEPOSITADAS LAS PARTES SELECCIONADAS (5) DEL CIRCUITO IMPRESO, DEJANDO LAS PARTES ELECTRODEPOSITADAS (5) SEPARADAS ELECTRICAMENTE, EXCEPTO COMO PODRIAN ESTAR CONECTADAS ELECTRICAMENTE DE OTRO MODO A TRAVES DE OTRAS VIAS EN LA PLACA (1) DE CIRCUITO IMPRESO.
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公开(公告)号：DE69112157D1
公开(公告)日：1995-09-21
申请号：DE69112157
申请日：1991-06-08
Applicant: IBM
Inventor： CIBULSKY MICHAEL J , PAPATHOMAS KOSTAS , SCHMITT GEORGE P
Abstract: A dicyandiamide crosslinked epoxy prepreg substantially free from dicyandiamide crystals is obtained by subjecting an epoxy composition containing dicyandiamide to elevated temperature to thereby form a substantially prereacted product, adding solvents if desired, desolvating, and then thermally advancing the prereacted product to the desired state of crosslinking to thereby form the prepreg.
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