公开(公告)号：DE3780089D1

公开(公告)日：1992-08-06

申请号：DE3780089

申请日：1987-04-10

Applicant: IBM

Inventor： CLEMENTI ROBERT JOSEPH ,  GAZDIK CHARLES EDWARD ,  LAFER WILLIAM ,  LOVESKY ROY LEWIS ,  MCBRIDE DONALD GENE ,  MUNSON JOEL VERN ,  SKARVINKO EUGENE PETER

IPC: H01L21/60 ,  H01L21/48 ,  H01L23/498 ,  H01L23/538 ,  H05K1/00 ,  H05K3/00 ,  H05K3/38 ,  H01L23/50 ,  H01L23/14

Abstract: An assembly and a method for making circuitized, flexible film substrates in a continuous tape format using a transfer technique. The tape (14) is made with window-like openings (18) having a relatively thin layer of polyimide (12) spanning the openings. The relatively thin layer of polyimide is transferred to the tape (14) from a metal carrier foil (10), preferably by using a special adhesive system. After the polyimide is transferred to the tape, the polyimide spanning the window-like openings in the tape is circuitized to form individual, circuitized, flexible film substrates (15) which may be handled in the tape format for further processing. Preferably, the tape includes perforations (16) for engaging sprockets of automated manufacturing equipment, or the like.

公开(公告)号：DE3780089T2

公开(公告)日：1993-02-04

申请号：DE3780089

申请日：1987-04-10

Applicant: IBM

Inventor： CLEMENTI ROBERT JOSEPH ,  GAZDIK CHARLES EDWARD ,  LAFER WILLIAM ,  LOVESKY ROY LEWIS ,  MCBRIDE DONALD GENE ,  MUNSON JOEL VERN ,  SKARVINKO EUGENE PETER

IPC: H01L21/60 ,  H01L21/48 ,  H01L23/498 ,  H01L23/538 ,  H05K1/00 ,  H05K3/00 ,  H05K3/38 ,  H01L23/50 ,  H01L23/14

Abstract: An assembly and a method for making circuitized, flexible film substrates in a continuous tape format using a transfer technique. The tape (14) is made with window-like openings (18) having a relatively thin layer of polyimide (12) spanning the openings. The relatively thin layer of polyimide is transferred to the tape (14) from a metal carrier foil (10), preferably by using a special adhesive system. After the polyimide is transferred to the tape, the polyimide spanning the window-like openings in the tape is circuitized to form individual, circuitized, flexible film substrates (15) which may be handled in the tape format for further processing. Preferably, the tape includes perforations (16) for engaging sprockets of automated manufacturing equipment, or the like.