公开(公告)号：DE68908089T2

公开(公告)日：1994-03-17

申请号：DE68908089

申请日：1989-09-19

Applicant: IBM

Inventor： REID JONATHAN DAVID ,  SKARVINKO EUGENE PETER ,  STARKS ARTHUR GORDON

IPC: C25D7/06

公开(公告)号：DE68908089D1

公开(公告)日：1993-09-09

申请号：DE68908089

申请日：1989-09-19

Applicant: IBM

Inventor： REID JONATHAN DAVID ,  SKARVINKO EUGENE PETER ,  STARKS ARTHUR GORDON

IPC: C25D7/06

公开(公告)号：DE3780089T2

公开(公告)日：1993-02-04

申请号：DE3780089

申请日：1987-04-10

Applicant: IBM

Inventor： CLEMENTI ROBERT JOSEPH ,  GAZDIK CHARLES EDWARD ,  LAFER WILLIAM ,  LOVESKY ROY LEWIS ,  MCBRIDE DONALD GENE ,  MUNSON JOEL VERN ,  SKARVINKO EUGENE PETER

IPC: H01L21/60 ,  H01L21/48 ,  H01L23/498 ,  H01L23/538 ,  H05K1/00 ,  H05K3/00 ,  H05K3/38 ,  H01L23/50 ,  H01L23/14

Abstract: An assembly and a method for making circuitized, flexible film substrates in a continuous tape format using a transfer technique. The tape (14) is made with window-like openings (18) having a relatively thin layer of polyimide (12) spanning the openings. The relatively thin layer of polyimide is transferred to the tape (14) from a metal carrier foil (10), preferably by using a special adhesive system. After the polyimide is transferred to the tape, the polyimide spanning the window-like openings in the tape is circuitized to form individual, circuitized, flexible film substrates (15) which may be handled in the tape format for further processing. Preferably, the tape includes perforations (16) for engaging sprockets of automated manufacturing equipment, or the like.

公开(公告)号：DE68912275T2

公开(公告)日：1994-06-30

申请号：DE68912275

申请日：1989-09-04

Applicant: IBM

Inventor： ALBRECHTA STANLEY MICHAEL ,  BURNS FRANCIS CHARLES ,  CARDEN GARY RICHARD ,  CHEN WILLIAM TZE-YOU ,  GRESKO ANDREW RICHARD ,  SKARVINKO EUGENE PETER ,  KAUFMAN JOHN JULIAN ,  TONSI NADIA

IPC: H01B7/08 ,  H01B13/00 ,  H01R27/00 ,  H05K1/05 ,  H05K1/11 ,  H05K3/00 ,  H05K3/38

Abstract: A flexible supporting cable for an electronic device which includes a steel foil substrate (1), a layer of polymer (2) on portions of the substrate, circuit pads (3) on the polymer layer having both the bottom and top surfaces of the pads exposed; circuit lines (5) extending from the top surface of the pads, a window (6) free from steel beneath a portion of the circuit lines (5), and a second, smaller window (7) free from both steel and the polymer beneath a portion of the circuit lines (5). Methods are provided for fabricating these flexible supporting cables.

公开(公告)号：DE68912275D1

公开(公告)日：1994-02-24

申请号：DE68912275

申请日：1989-09-04

Applicant: IBM

Inventor： ALBRECHTA STANLEY MICHAEL ,  BURNS FRANCIS CHARLES ,  CARDEN GARY RICHARD ,  CHEN WILLIAM TZE-YOU ,  GRESKO ANDREW RICHARD ,  SKARVINKO EUGENE PETER ,  KAUFMAN JOHN JULIAN ,  TONSI NADIA

IPC: H01B7/08 ,  H01B13/00 ,  H01R27/00 ,  H05K1/05 ,  H05K1/11 ,  H05K3/00 ,  H05K3/38

Abstract: A flexible supporting cable for an electronic device which includes a steel foil substrate (1), a layer of polymer (2) on portions of the substrate, circuit pads (3) on the polymer layer having both the bottom and top surfaces of the pads exposed; circuit lines (5) extending from the top surface of the pads, a window (6) free from steel beneath a portion of the circuit lines (5), and a second, smaller window (7) free from both steel and the polymer beneath a portion of the circuit lines (5). Methods are provided for fabricating these flexible supporting cables.

公开(公告)号：DE3780089D1

公开(公告)日：1992-08-06

申请号：DE3780089

申请日：1987-04-10

Applicant: IBM

Inventor： CLEMENTI ROBERT JOSEPH ,  GAZDIK CHARLES EDWARD ,  LAFER WILLIAM ,  LOVESKY ROY LEWIS ,  MCBRIDE DONALD GENE ,  MUNSON JOEL VERN ,  SKARVINKO EUGENE PETER

IPC: H01L21/60 ,  H01L21/48 ,  H01L23/498 ,  H01L23/538 ,  H05K1/00 ,  H05K3/00 ,  H05K3/38 ,  H01L23/50 ,  H01L23/14

Abstract: An assembly and a method for making circuitized, flexible film substrates in a continuous tape format using a transfer technique. The tape (14) is made with window-like openings (18) having a relatively thin layer of polyimide (12) spanning the openings. The relatively thin layer of polyimide is transferred to the tape (14) from a metal carrier foil (10), preferably by using a special adhesive system. After the polyimide is transferred to the tape, the polyimide spanning the window-like openings in the tape is circuitized to form individual, circuitized, flexible film substrates (15) which may be handled in the tape format for further processing. Preferably, the tape includes perforations (16) for engaging sprockets of automated manufacturing equipment, or the like.