公开(公告)号：DE3763518D1

公开(公告)日：1990-08-09

申请号：DE3763518

申请日：1987-04-10

Applicant: IBM

Inventor： MCBRIDE DONALD GENE ,  RICKERT ROBERT GEORGE

IPC: C23C18/16 ,  C23C18/31 ,  C23C18/40 ,  C23C18/38

公开(公告)号：DE3780089T2

公开(公告)日：1993-02-04

申请号：DE3780089

申请日：1987-04-10

Applicant: IBM

Inventor： CLEMENTI ROBERT JOSEPH ,  GAZDIK CHARLES EDWARD ,  LAFER WILLIAM ,  LOVESKY ROY LEWIS ,  MCBRIDE DONALD GENE ,  MUNSON JOEL VERN ,  SKARVINKO EUGENE PETER

IPC: H01L21/60 ,  H01L21/48 ,  H01L23/498 ,  H01L23/538 ,  H05K1/00 ,  H05K3/00 ,  H05K3/38 ,  H01L23/50 ,  H01L23/14

Abstract: An assembly and a method for making circuitized, flexible film substrates in a continuous tape format using a transfer technique. The tape (14) is made with window-like openings (18) having a relatively thin layer of polyimide (12) spanning the openings. The relatively thin layer of polyimide is transferred to the tape (14) from a metal carrier foil (10), preferably by using a special adhesive system. After the polyimide is transferred to the tape, the polyimide spanning the window-like openings in the tape is circuitized to form individual, circuitized, flexible film substrates (15) which may be handled in the tape format for further processing. Preferably, the tape includes perforations (16) for engaging sprockets of automated manufacturing equipment, or the like.

公开(公告)号：DE3775980D1

公开(公告)日：1992-02-27

申请号：DE3775980

申请日：1987-04-14

Applicant: IBM

Inventor： MCBRIDE DONALD GENE ,  SHAW JANE MARGARET

IPC: G03F7/075 ,  H01L21/60 ,  H05K3/34 ,  G03F7/26

公开(公告)号：DE3568594D1

公开(公告)日：1989-04-13

申请号：DE3568594

申请日：1985-06-03

Applicant: IBM

Inventor： CANESTARO MICHAEL JAMES ,  KASCHAK RONALD ANTHONY ,  MCBRIDE DONALD GENE ,  SERAPHIM DONALD PHILIP

IPC: C23C18/16 ,  C23C18/31 ,  C23C18/34 ,  C23C18/40 ,  C23C18/44 ,  H05K3/18

公开(公告)号：DE3371798D1

公开(公告)日：1987-07-02

申请号：DE3371798

申请日：1983-06-23

Applicant: IBM

Inventor： CANESTARO MICHAEL JAMES ,  MCBRIDE DONALD GENE ,  WELSH JOHN ANDREW

IPC: C23C18/18 ,  C23C18/16 ,  C23C18/38 ,  C23C18/42 ,  C25D5/02 ,  G03F7/11 ,  H01L21/70 ,  H05K3/10 ,  H05K3/24 ,  H05K3/38 ,  H01L27/01 ,  G03F7/02

Abstract: A method of decreasing plated metal defects by applying a layer of a noble metal such as palladium, platinum, gold, iridium, rhodium, or mixtures thereof between a photoresist and a metallic surface.

公开(公告)号：DE3888552D1

公开(公告)日：1994-04-28

申请号：DE3888552

申请日：1988-01-29

Applicant: IBM

Inventor： GAZDIK CHARLES EDWARD ,  MCBRIDE DONALD GENE ,  SERAPHIM DONALD PHILLIP ,  TOOLE PATRICK ALBERT

IPC: H01L21/60 ,  H01L23/538 ,  H01L25/04 ,  H01L25/065 ,  H01L25/18 ,  H01L23/38

公开(公告)号：DE3783831D1

公开(公告)日：1993-03-11

申请号：DE3783831

申请日：1987-05-12

Applicant: IBM

Inventor： MCBRIDE DONALD GENE ,  RICKERT ROBERT GEORGE

IPC: C23C18/31 ,  C23C18/16 ,  C23C18/40 ,  H05K3/18 ,  G01N27/22

Abstract: An electroless plating bath (11) is selectively cleaned of organic contaminants. The organic contaminants are detected by measuring the capacitance between a working electrode (26) and counter electrode (27) with a potentiostat (31). The capacitance measurements are used to indicate the level of organic contaminants. Exposure of the dummy plating surface (39) in the electroless plating bath is controlled such that the exposed surface is directly proportional to the detected level of organic contaminants.

公开(公告)号：DE3780089D1

公开(公告)日：1992-08-06

申请号：DE3780089

申请日：1987-04-10

Applicant: IBM

Inventor： CLEMENTI ROBERT JOSEPH ,  GAZDIK CHARLES EDWARD ,  LAFER WILLIAM ,  LOVESKY ROY LEWIS ,  MCBRIDE DONALD GENE ,  MUNSON JOEL VERN ,  SKARVINKO EUGENE PETER

IPC: H01L21/60 ,  H01L21/48 ,  H01L23/498 ,  H01L23/538 ,  H05K1/00 ,  H05K3/00 ,  H05K3/38 ,  H01L23/50 ,  H01L23/14

Abstract: An assembly and a method for making circuitized, flexible film substrates in a continuous tape format using a transfer technique. The tape (14) is made with window-like openings (18) having a relatively thin layer of polyimide (12) spanning the openings. The relatively thin layer of polyimide is transferred to the tape (14) from a metal carrier foil (10), preferably by using a special adhesive system. After the polyimide is transferred to the tape, the polyimide spanning the window-like openings in the tape is circuitized to form individual, circuitized, flexible film substrates (15) which may be handled in the tape format for further processing. Preferably, the tape includes perforations (16) for engaging sprockets of automated manufacturing equipment, or the like.

公开(公告)号：DE3377440D1

公开(公告)日：1988-08-25

申请号：DE3377440

申请日：1983-11-03

Applicant: IBM

Inventor： GAZDIK CHARLES EDWARD ,  MCBRIDE DONALD GENE

IPC: H01L23/52 ,  H01L21/48 ,  H01L21/60 ,  H01L23/14 ,  H01L23/538 ,  H05K1/00 ,  H05K3/00 ,  H05K3/20 ,  H05K3/38 ,  H05K3/46

Abstract: @ A high density electronic circuit module includes a chip (55) carrying, thin, flexible film (30) having circuitry (20, 40) on both sides thereof. The double-sided circuitry is fabricated by depositing a first layer (20) of chrome-copper-chrome circuitry on an aluminum substrate (10). This first circuitry layer is covered with a layer of polyimide (30). Vias (30A, 30B) are etched into the polyimide. Next, a second layer of chrome-copper-chrome circuitry (40) is deposited on top of the polyimide. The first and second layers of circuitry are connected through the etched vias. Finally, hydrochloric acid is utilized to etch away the aluminum substrate. Hydrochloric acid etches aluminum but not the chrome-copper-chrome circuitry.

公开(公告)号：DE3060711D1

公开(公告)日：1982-09-30

申请号：DE3060711

申请日：1980-01-04

Applicant: IBM

Inventor： GAZDIK CHARLES EDWARD ,  MCBRIDE DONALD GENE

IPC: H05K1/00 ,  H01L21/48 ,  H01L21/60 ,  H01L23/538 ,  H05K1/03 ,  H05K1/14 ,  H05K1/18 ,  H05K3/00 ,  H01L23/14