公开(公告)号：WO2009111163A3

公开(公告)日：2010-01-21

申请号：PCT/US2009034350

申请日：2009-02-18

Applicant: IBM ,  BUMM LLOYD ,  DAHAYANAKA DAMINDA ,  KASZUBA PHILIP V ,  MOSZKOWICZ LEON ,  SLINKMAN JAMES A

Inventor： BUMM LLOYD ,  DAHAYANAKA DAMINDA ,  KASZUBA PHILIP V ,  MOSZKOWICZ LEON ,  SLINKMAN JAMES A

IPC: G01N21/86

CPC classification number: G01B21/32 ,  G01Q60/30

Abstract: A method of detecting local mechanical stress in integrated devices is provided, the method comprising: enabling the detection of a photo voltage difference between a scan probe device (14) and a surface portion (30) of an integrated device (18), the scan probe device (14) being configured to deflect in response to the photo voltage difference; measuring the deflection of the scan probe device (14) in response to the photo voltage difference between the scan probe device (14) and the surface portion (30) of the integrated device (18); and calculating a local stress level within the integrated device by determining a local work function of the surface portion (30) of the integrated device (18) based upon the deflection of the scan probe device (14).

Abstract translation: 提供了一种在集成器件中检测局部机械应力的方法，所述方法包括：能够检测扫描探针器件（14）与集成器件（18）的表面部分（30）之间的光电压差，扫描 探针装置（14）被配置为响应于光电压差而偏转; 响应于扫描探针装置（14）和集成装置（18）的表面部分（30）之间的光电压差，测量扫描探针装置（14）的偏转; 以及基于所述扫描探针装置（14）的偏转来确定所述集成装置（18）的所述表面部分（30）的局部功函数来计算所述集成装置内的局部应力水平。

公开(公告)号：BRPI0906029A2

公开(公告)日：2015-06-30

申请号：BRPI0906029

申请日：2009-02-18

Applicant: IBM

Inventor： BUMM LLOYD ,  DAHAYANAKA DAMINDA ,  KASZUBA PHILIP A ,  MOSZKOWICZ LEON ,  SLINKMAN JAMES A

IPC: G01N21/86