公开(公告)号：EP1570514A4

公开(公告)日：2008-11-19

申请号：EP02797269

申请日：2002-12-10

Applicant: IBM

Inventor： BANKE G WILLIAM JR ,  DEERING ANDREW ,  KASZUBA PHILIP V ,  MOSZKOWICZ LEON ,  ROBERT JAMES ,  SLINKMAN JAMES A

IPC: A61M1/00 ,  G01N1/32 ,  G01Q30/04 ,  G01Q30/20 ,  G01Q60/00 ,  G01R31/28 ,  G06F19/00 ,  H01L21/66

CPC classification number: A61M1/0058 ,  A61M1/0084 ,  G01N1/32 ,  G01R31/2898

Abstract: A method for measuring an integrated circuit (IC) structure (12) by measuring an imprint (30) of the structure, a method for preparing a test site (26) for the above measuring, and IC (10) so formed. The method for preparing the test site includes incrementally removing the structure from the substrate so as to reveal an imprint (30) of the removed bottom surface of the structure in a top surface (32) of the substrate. The imprint can then be imaged using an atomic force microscope (AFM) (40). The image (50) can be used to measure the bottom surface of the structure.

公开(公告)号：WO2009111163A3

公开(公告)日：2010-01-21

申请号：PCT/US2009034350

申请日：2009-02-18

Applicant: IBM ,  BUMM LLOYD ,  DAHAYANAKA DAMINDA ,  KASZUBA PHILIP V ,  MOSZKOWICZ LEON ,  SLINKMAN JAMES A

Inventor： BUMM LLOYD ,  DAHAYANAKA DAMINDA ,  KASZUBA PHILIP V ,  MOSZKOWICZ LEON ,  SLINKMAN JAMES A

IPC: G01N21/86

CPC classification number: G01B21/32 ,  G01Q60/30

Abstract: A method of detecting local mechanical stress in integrated devices is provided, the method comprising: enabling the detection of a photo voltage difference between a scan probe device (14) and a surface portion (30) of an integrated device (18), the scan probe device (14) being configured to deflect in response to the photo voltage difference; measuring the deflection of the scan probe device (14) in response to the photo voltage difference between the scan probe device (14) and the surface portion (30) of the integrated device (18); and calculating a local stress level within the integrated device by determining a local work function of the surface portion (30) of the integrated device (18) based upon the deflection of the scan probe device (14).

Abstract translation: 提供了一种在集成器件中检测局部机械应力的方法，所述方法包括：能够检测扫描探针器件（14）与集成器件（18）的表面部分（30）之间的光电压差，扫描 探针装置（14）被配置为响应于光电压差而偏转; 响应于扫描探针装置（14）和集成装置（18）的表面部分（30）之间的光电压差，测量扫描探针装置（14）的偏转; 以及基于所述扫描探针装置（14）的偏转来确定所述集成装置（18）的所述表面部分（30）的局部功函数来计算所述集成装置内的局部应力水平。

公开(公告)号：WO2004053928A3

公开(公告)日：2005-05-19

申请号：PCT/US0239521

申请日：2002-12-10

Applicant: IBM ,  BANKE G WILLIAM JR ,  DEERING ANDREW ,  KASZUBA PHILIP V ,  MOSZKOWICZ LEON ,  ROBERT JAMES ,  SLINKMAN JAMES A

Inventor： BANKE G WILLIAM JR ,  DEERING ANDREW ,  KASZUBA PHILIP V ,  MOSZKOWICZ LEON ,  ROBERT JAMES ,  SLINKMAN JAMES A

IPC: A61M1/00 ,  G01N1/32 ,  G01Q30/04 ,  G01Q30/20 ,  G01Q60/00 ,  G01R31/28 ,  G06F19/00 ,  H01L21/66 ,  G01M19/00 ,  H01L23/58

CPC classification number: A61M1/0058 ,  A61M1/0084 ,  G01N1/32 ,  G01R31/2898

Abstract: A method for measuring an integrated circuit (IC) structure (12) by measuring an imprint (30) of the structure, a method for preparing a test site (26) for the above measuring, and IC (10) so formed. The method for preparing the test site includes incrementally removing the structure from the substrate so as to reveal an imprint (30) of the removed bottom surface of the structure in a top surface (32) of the substrate. The imprint can then be imaged using an atomic force microscope (AFM) (40). The image (50) can be used to measure the bottom surface of the structure.

Abstract translation: 通过测量该结构的印记（30）来测量集成电路（IC）结构（12）的方法，制备用于上述测量的测试点（26）的方法和如此形成的IC（10）。 制备测试部位的方法包括从衬底逐渐去除结构，以便在衬底的顶表面（32）中露出结构的去除的底表面的压印（30）。 然后使用原子力显微镜（AFM）对印记进行成像（40）。 图像（50）可用于测量结构的底面。

公开(公告)号：AU2002362136A1

公开(公告)日：2004-06-30

申请号：AU2002362136

申请日：2002-12-10

Applicant: IBM

Inventor： DEERING ANDREW ,  KASZUBA PHILIP V ,  MOSZKOWICZ LEON ,  ROBERT JAMES ,  SLINKMAN JAMES A ,  BANKE G WILLIAM JR

IPC: A61M1/00 ,  G01M99/00 ,  G01N1/32 ,  G01Q30/04 ,  G01Q30/20 ,  G01Q60/00 ,  G01R31/28 ,  G06F19/00 ,  H01L21/66

Abstract: A method for measuring an integrated circuit (IC) structure by measuring an imprint of the structure, a method for preparing a test site for the above measuring, and IC so formed. The method for preparing the test site includes incrementally removing the structure from the substrate so as to reveal an imprint of the removed bottom surface of the structure in a top surface of the substrate. The imprint can then be imaged using an atomic force microscope (AFM). The image can be used to measure the bottom surface of the structure.

公开(公告)号：AU2002362136A8

公开(公告)日：2004-06-30

申请号：AU2002362136

申请日：2002-12-10

Applicant: IBM

Inventor： BANKE G WILLIAM JR ,  DEERING ANDREW ,  KASZUBA PHILIP V ,  ROBERT JAMES ,  MOSZKOWICZ LEON ,  SLINKMAN JAMES A

IPC: A61M1/00 ,  G01M99/00 ,  G01N1/32 ,  G01Q30/04 ,  G01Q30/20 ,  G01Q60/00 ,  G01R31/28 ,  G06F19/00 ,  H01L21/66 ,  G01M19/00 ,  H01L23/58

Abstract: A method for measuring an integrated circuit (IC) structure by measuring an imprint of the structure, a method for preparing a test site for the above measuring, and IC so formed. The method for preparing the test site includes incrementally removing the structure from the substrate so as to reveal an imprint of the removed bottom surface of the structure in a top surface of the substrate. The imprint can then be imaged using an atomic force microscope (AFM). The image can be used to measure the bottom surface of the structure.

公开(公告)号：BRPI0906029A2

公开(公告)日：2015-06-30

申请号：BRPI0906029

申请日：2009-02-18

Applicant: IBM

Inventor： BUMM LLOYD ,  DAHAYANAKA DAMINDA ,  KASZUBA PHILIP A ,  MOSZKOWICZ LEON ,  SLINKMAN JAMES A

IPC: G01N21/86