公开(公告)号：EP1570514A4

公开(公告)日：2008-11-19

申请号：EP02797269

申请日：2002-12-10

Applicant: IBM

Inventor： BANKE G WILLIAM JR ,  DEERING ANDREW ,  KASZUBA PHILIP V ,  MOSZKOWICZ LEON ,  ROBERT JAMES ,  SLINKMAN JAMES A

IPC: A61M1/00 ,  G01N1/32 ,  G01Q30/04 ,  G01Q30/20 ,  G01Q60/00 ,  G01R31/28 ,  G06F19/00 ,  H01L21/66

CPC classification number: A61M1/0058 ,  A61M1/0084 ,  G01N1/32 ,  G01R31/2898

Abstract: A method for measuring an integrated circuit (IC) structure (12) by measuring an imprint (30) of the structure, a method for preparing a test site (26) for the above measuring, and IC (10) so formed. The method for preparing the test site includes incrementally removing the structure from the substrate so as to reveal an imprint (30) of the removed bottom surface of the structure in a top surface (32) of the substrate. The imprint can then be imaged using an atomic force microscope (AFM) (40). The image (50) can be used to measure the bottom surface of the structure.

公开(公告)号：WO2004053928A3

公开(公告)日：2005-05-19

申请号：PCT/US0239521

申请日：2002-12-10

Applicant: IBM ,  BANKE G WILLIAM JR ,  DEERING ANDREW ,  KASZUBA PHILIP V ,  MOSZKOWICZ LEON ,  ROBERT JAMES ,  SLINKMAN JAMES A

Inventor： BANKE G WILLIAM JR ,  DEERING ANDREW ,  KASZUBA PHILIP V ,  MOSZKOWICZ LEON ,  ROBERT JAMES ,  SLINKMAN JAMES A

IPC: A61M1/00 ,  G01N1/32 ,  G01Q30/04 ,  G01Q30/20 ,  G01Q60/00 ,  G01R31/28 ,  G06F19/00 ,  H01L21/66 ,  G01M19/00 ,  H01L23/58

CPC classification number: A61M1/0058 ,  A61M1/0084 ,  G01N1/32 ,  G01R31/2898

Abstract: A method for measuring an integrated circuit (IC) structure (12) by measuring an imprint (30) of the structure, a method for preparing a test site (26) for the above measuring, and IC (10) so formed. The method for preparing the test site includes incrementally removing the structure from the substrate so as to reveal an imprint (30) of the removed bottom surface of the structure in a top surface (32) of the substrate. The imprint can then be imaged using an atomic force microscope (AFM) (40). The image (50) can be used to measure the bottom surface of the structure.

Abstract translation: 通过测量该结构的印记（30）来测量集成电路（IC）结构（12）的方法，制备用于上述测量的测试点（26）的方法和如此形成的IC（10）。 制备测试部位的方法包括从衬底逐渐去除结构，以便在衬底的顶表面（32）中露出结构的去除的底表面的压印（30）。 然后使用原子力显微镜（AFM）对印记进行成像（40）。 图像（50）可用于测量结构的底面。

公开(公告)号：AU2002362136A1

公开(公告)日：2004-06-30

申请号：AU2002362136

申请日：2002-12-10

Applicant: IBM

Inventor： DEERING ANDREW ,  KASZUBA PHILIP V ,  MOSZKOWICZ LEON ,  ROBERT JAMES ,  SLINKMAN JAMES A ,  BANKE G WILLIAM JR

IPC: A61M1/00 ,  G01M99/00 ,  G01N1/32 ,  G01Q30/04 ,  G01Q30/20 ,  G01Q60/00 ,  G01R31/28 ,  G06F19/00 ,  H01L21/66

Abstract: A method for measuring an integrated circuit (IC) structure by measuring an imprint of the structure, a method for preparing a test site for the above measuring, and IC so formed. The method for preparing the test site includes incrementally removing the structure from the substrate so as to reveal an imprint of the removed bottom surface of the structure in a top surface of the substrate. The imprint can then be imaged using an atomic force microscope (AFM). The image can be used to measure the bottom surface of the structure.

公开(公告)号：AU2002362136A8

公开(公告)日：2004-06-30

申请号：AU2002362136

申请日：2002-12-10

Applicant: IBM

Inventor： BANKE G WILLIAM JR ,  DEERING ANDREW ,  KASZUBA PHILIP V ,  ROBERT JAMES ,  MOSZKOWICZ LEON ,  SLINKMAN JAMES A

IPC: A61M1/00 ,  G01M99/00 ,  G01N1/32 ,  G01Q30/04 ,  G01Q30/20 ,  G01Q60/00 ,  G01R31/28 ,  G06F19/00 ,  H01L21/66 ,  G01M19/00 ,  H01L23/58

Abstract: A method for measuring an integrated circuit (IC) structure by measuring an imprint of the structure, a method for preparing a test site for the above measuring, and IC so formed. The method for preparing the test site includes incrementally removing the structure from the substrate so as to reveal an imprint of the removed bottom surface of the structure in a top surface of the substrate. The imprint can then be imaged using an atomic force microscope (AFM). The image can be used to measure the bottom surface of the structure.