公开(公告)号：JP2001168156A

公开(公告)日：2001-06-22

申请号：JP2000305671

申请日：2000-10-05

Applicant: IBM

Inventor： PAUL M GASUKE ,  THOMAS W BACHELDER ,  DENISE R BARINGER ,  DENISE R CONCH ,  JAMES M CRAFTS ,  DAVID L GADEL ,  MARK R LAFOSSE ,  PERRY CHARLES H ,  DR ROGER R SKUMID ,  JOSEPH J VAN HORNE ,  WAYDE H WHITE

IPC: G01R31/26 ,  G01R1/06 ,  G01R1/073 ,  G01R31/28 ,  H01L21/66

Abstract: PROBLEM TO BE SOLVED: To provide an apparatus for burn-in testing chips on a wafer at once. SOLUTION: The apparatus for testing a product/chips on a circular product wafer comprises an O-ring seal provided apart from the wafer so as to surround the wafer, a chuck having a vacuum port provided between the O-ring seal and the wafer, a first board having a probe contacting the chips on the wafer at one end and a contact at the other end, a second board having a tester chip mounted at one side and a contact connected to the contact of the first board at the other end, a test head having a peripheral part engaged with the O-ring seal, a means for selectively feeding a vacuum pressure to the vacuum port, and means for selectively moving the chuck in a direction parallel or perpendicular to the surface of the test head.

公开(公告)号：JP2003124655A

公开(公告)日：2003-04-25

申请号：JP2002236442

申请日：2002-08-14

Applicant: IBM

Inventor： DENISE R BARINGER ,  NOTOHARDJONO BUDY D ,  TOFFLER HAROLD M

IPC: H05K9/00 ,  H05K5/02 ,  H05K7/14

Abstract: PROBLEM TO BE SOLVED: To provide a circuit substrate capable of mounting electronic circuit parts in a densely installed space. SOLUTION: A print circuit substrate assembly is provided with a print circuit substrate 300. The print circuit substrate 300 is provided with a print circuit card, electrically connected to the parts attached to the print circuit substrate 300. The print circuit substrate 300 is also provided with a guide 350 in the level of the substrate. The guide 350 is provided with a slot for receiving a protrusion 111, provided on the outside lower part of a cartridge 100 for transferring the print circuit guide and having a configuration coping with the protrusion 111. Respective cartridges 111 are preferable to be provided on only one side of respective cartridges 111. According to this method, the mounting density of the parts can be increased. An enclosure and storage device or a cabinet is not required to be contacted physically with the circuit substrate by providing the surface guide 111 in cooperation with the design of the cartridge 100.

公开(公告)号：JP2001358187A

公开(公告)日：2001-12-26

申请号：JP2001107697

申请日：2001-04-05

Applicant: IBM

Inventor： PAUL M GASUKE ,  THOMAS W BACHELDER ,  DENISE R BARINGER ,  DENISE R CONCH ,  JAMES M CRAFTS ,  DAVID L GADEL ,  MARK R LAFOSSE ,  PERRY CHARLES H ,  DR ROGER R SKUMID ,  JOSEPH J VAN HORNE ,  WAYDE H WHITE

IPC: G01R31/26 ,  G01R1/06 ,  G01R1/073 ,  G01R31/28 ,  H01L21/66

Abstract: PROBLEM TO BE SOLVED: To provide a device for simultaneously testing or burning, in a very plurality of integrated circuit chips on a product wafer. SOLUTION: This device contains a prober 44, mounted on a first board 22 and a tester chip 28 mounted on a second board 24, and an electrical connector 78 connecting the two boards provided to each other. In order for a power to distribute to the product chip, or in order to test the product chip, a tester chip 28 is provided. Wirings of the probers 44 and a thin film 42, to which they are mounted, are dedicated for a pad frit printing of a specific wafer 26 to be probed. Both a base 40 of the first board 22 and the second board 24 are similarly maintained, with respect to all the wafers within a product family.

公开(公告)号：JPH11251383A

公开(公告)日：1999-09-17

申请号：JP36136198

申请日：1998-12-18

Applicant: IBM

Inventor： PAUL M GASUKE ,  THOMAS W BACHELDER ,  DENISE R BARINGER ,  DENISE R CONCH ,  JAMES M CRAFTS ,  DAVID L GADEL ,  MARK R LAFOSSE ,  PERRY CHARLES H ,  DR ROGER R SKUMID ,  JOSEPH J VAN HORNE ,  WAYDE H WHITE

IPC: G01R31/26 ,  G01R1/06 ,  G01R1/073 ,  G01R31/28 ,  H01L21/66

Abstract: PROBLEM TO BE SOLVED: To provide a device for testing an extremely large number of integrated circuit chips on a product wafer at the same time or for barn-in. SOLUTION: A device includes a probe 44 mounted on a first board 22 and a tester chip 28 mounted on a second board 24 and provides an electrical connector 78 for connecting the two boards. A tester chip 28 is provided for distributing power in product chips or testing the product chips. A probe 44 and a wiring of a thin film 42 whereon the probe 44, etc., are mounted are exclusively used for a pad-foot printing of a specified wafer 26 to be probed. Both a base 40 of the first board 22 and the second board 24 are maintained equally with respect to all wafers in a product family.