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公开(公告)号：JP2001168156A
公开(公告)日：2001-06-22
申请号：JP2000305671
申请日：2000-10-05
Applicant: IBM
Inventor： PAUL M GASUKE , THOMAS W BACHELDER , DENISE R BARINGER , DENISE R CONCH , JAMES M CRAFTS , DAVID L GADEL , MARK R LAFOSSE , PERRY CHARLES H , DR ROGER R SKUMID , JOSEPH J VAN HORNE , WAYDE H WHITE
Abstract: PROBLEM TO BE SOLVED: To provide an apparatus for burn-in testing chips on a wafer at once. SOLUTION: The apparatus for testing a product/chips on a circular product wafer comprises an O-ring seal provided apart from the wafer so as to surround the wafer, a chuck having a vacuum port provided between the O-ring seal and the wafer, a first board having a probe contacting the chips on the wafer at one end and a contact at the other end, a second board having a tester chip mounted at one side and a contact connected to the contact of the first board at the other end, a test head having a peripheral part engaged with the O-ring seal, a means for selectively feeding a vacuum pressure to the vacuum port, and means for selectively moving the chuck in a direction parallel or perpendicular to the surface of the test head.
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Patent Agency Ranking
公开(公告)号：JP2002134926A
公开(公告)日：2002-05-10
申请号：JP2001193284
申请日：2001-06-26
Applicant: IBM
Inventor： DANIEL GEORGE BERGER , FAROOQ SHAJI , HERRON LESTER WYNN , HUMENIK JAMES N , KNICKERBOCKER JOHN ULRICH , PASCO ROBERT WILLIAM , PERRY CHARLES H , SACHDEV KRISHNA G
Abstract: PROBLEM TO BE SOLVED: To provide an organic inorganic compound electronic substrate which can be manufactured at a low cost, a compound electronic substrate wherein relative permitivity, impedance, CTE, double refraction and mutual connection stress are low, and package card reliability is high, a compound electronic substrate wherein Tg is high and thermal stability is superior, and a compound electronic substrate having low hygroscopicity. SOLUTION: A compound electronic and/or optical substrate contains polymer material and ceramic material, and has relative permitivity lower than 4 and coefficient of thermal expansion of 8-14 ppm/ deg.C at 100 deg.C. This compound substrate is composed of polymer material containing ceramic filler material or ceramic material containing polymer filler material.
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公开(公告)号：JP2001358187A
公开(公告)日：2001-12-26
申请号：JP2001107697
申请日：2001-04-05
Applicant: IBM
Inventor： PAUL M GASUKE , THOMAS W BACHELDER , DENISE R BARINGER , DENISE R CONCH , JAMES M CRAFTS , DAVID L GADEL , MARK R LAFOSSE , PERRY CHARLES H , DR ROGER R SKUMID , JOSEPH J VAN HORNE , WAYDE H WHITE
Abstract: PROBLEM TO BE SOLVED: To provide a device for simultaneously testing or burning, in a very plurality of integrated circuit chips on a product wafer. SOLUTION: This device contains a prober 44, mounted on a first board 22 and a tester chip 28 mounted on a second board 24, and an electrical connector 78 connecting the two boards provided to each other. In order for a power to distribute to the product chip, or in order to test the product chip, a tester chip 28 is provided. Wirings of the probers 44 and a thin film 42, to which they are mounted, are dedicated for a pad frit printing of a specific wafer 26 to be probed. Both a base 40 of the first board 22 and the second board 24 are similarly maintained, with respect to all the wafers within a product family.
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公开(公告)号：JPH11251383A
公开(公告)日：1999-09-17
申请号：JP36136198
申请日：1998-12-18
Applicant: IBM
Inventor： PAUL M GASUKE , THOMAS W BACHELDER , DENISE R BARINGER , DENISE R CONCH , JAMES M CRAFTS , DAVID L GADEL , MARK R LAFOSSE , PERRY CHARLES H , DR ROGER R SKUMID , JOSEPH J VAN HORNE , WAYDE H WHITE
Abstract: PROBLEM TO BE SOLVED: To provide a device for testing an extremely large number of integrated circuit chips on a product wafer at the same time or for barn-in. SOLUTION: A device includes a probe 44 mounted on a first board 22 and a tester chip 28 mounted on a second board 24 and provides an electrical connector 78 for connecting the two boards. A tester chip 28 is provided for distributing power in product chips or testing the product chips. A probe 44 and a wiring of a thin film 42 whereon the probe 44, etc., are mounted are exclusively used for a pad-foot printing of a specified wafer 26 to be probed. Both a base 40 of the first board 22 and the second board 24 are maintained equally with respect to all wafers in a product family.
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公开(公告)号：MY117336A
公开(公告)日：2004-06-30
申请号：MYPI20012928
申请日：2001-06-21
Applicant: IBM
Inventor： BERGER DANIEL GEORGE , FAROOQ SHAJI , HERRON LESTER WYNN , HUMENIK JAMES N , KNICKERBOCKER JOHN ULRICH , PASCO ROBERT WILLIAM , PERRY CHARLES H , SACHDEV KRISHNA G
IPC: B32B5/16 , B32B18/00 , G02B6/12 , G02B6/00 , H01L21/48 , H01L23/14 , H01L23/498 , H05K1/03 , H05K1/05 , H05K3/46
Abstract: A COMPOSITE ELECTRONIC AND/OR OPTICAL SUBSTRATE INCLUDING POLYMERIC AND CERAMIC MATERIAL WHEREIN THE COMPOSITE SUBSTRATE HAS A DIELECTRIC CONSTANT LESS THAN 4 AND A COEFFICIENT OF THERMAL EXPANSION OF 8 TO 14 PPM/°C AT 100°C. THE COMPOSITE SUBSTRATE MAY BE EITHER CERAMIC-FILLED POLYMERIC MATERIAL OR POLYMER-FILLED CERAMIC MATERIAL. (FIGURE 1)
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公开(公告)号：CA1114000A
公开(公告)日：1981-12-08
申请号：CA307634
申请日：1978-07-18
Applicant: IBM
Inventor： PERRY CHARLES H
Abstract: IMPROVED GAS PANEL SPACER Gaseous discharge display systems represent a sophisticated technology which requires that the physical parameters of the device such as the discharge gap be maintained within close tolerances. To provide a uniform discharge gap over the entire surface of the display panel, particularly in large size displays, metallic spacers are bonded to the dielectric of one of the plates at predetermined intervals, and the metallic spacers are protected from interaction with the gas particles by a layer of refractory material applied thereover. Also disclosed are means for modifying the physical characteristics of the spacers to eliminate reflected light and render the spacers substantially invisible.
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