-
公开(公告)号：JP2001168156A
公开(公告)日：2001-06-22
申请号：JP2000305671
申请日：2000-10-05
Applicant: IBM
Inventor： PAUL M GASUKE , THOMAS W BACHELDER , DENISE R BARINGER , DENISE R CONCH , JAMES M CRAFTS , DAVID L GADEL , MARK R LAFOSSE , PERRY CHARLES H , DR ROGER R SKUMID , JOSEPH J VAN HORNE , WAYDE H WHITE
Abstract: PROBLEM TO BE SOLVED: To provide an apparatus for burn-in testing chips on a wafer at once. SOLUTION: The apparatus for testing a product/chips on a circular product wafer comprises an O-ring seal provided apart from the wafer so as to surround the wafer, a chuck having a vacuum port provided between the O-ring seal and the wafer, a first board having a probe contacting the chips on the wafer at one end and a contact at the other end, a second board having a tester chip mounted at one side and a contact connected to the contact of the first board at the other end, a test head having a peripheral part engaged with the O-ring seal, a means for selectively feeding a vacuum pressure to the vacuum port, and means for selectively moving the chuck in a direction parallel or perpendicular to the surface of the test head.
-
公开(公告)号：JP2001358187A
公开(公告)日：2001-12-26
申请号：JP2001107697
申请日：2001-04-05
Applicant: IBM
Inventor： PAUL M GASUKE , THOMAS W BACHELDER , DENISE R BARINGER , DENISE R CONCH , JAMES M CRAFTS , DAVID L GADEL , MARK R LAFOSSE , PERRY CHARLES H , DR ROGER R SKUMID , JOSEPH J VAN HORNE , WAYDE H WHITE
Abstract: PROBLEM TO BE SOLVED: To provide a device for simultaneously testing or burning, in a very plurality of integrated circuit chips on a product wafer. SOLUTION: This device contains a prober 44, mounted on a first board 22 and a tester chip 28 mounted on a second board 24, and an electrical connector 78 connecting the two boards provided to each other. In order for a power to distribute to the product chip, or in order to test the product chip, a tester chip 28 is provided. Wirings of the probers 44 and a thin film 42, to which they are mounted, are dedicated for a pad frit printing of a specific wafer 26 to be probed. Both a base 40 of the first board 22 and the second board 24 are similarly maintained, with respect to all the wafers within a product family.
-
公开(公告)号：JPH11251383A
公开(公告)日：1999-09-17
申请号：JP36136198
申请日：1998-12-18
Applicant: IBM
Inventor： PAUL M GASUKE , THOMAS W BACHELDER , DENISE R BARINGER , DENISE R CONCH , JAMES M CRAFTS , DAVID L GADEL , MARK R LAFOSSE , PERRY CHARLES H , DR ROGER R SKUMID , JOSEPH J VAN HORNE , WAYDE H WHITE
Abstract: PROBLEM TO BE SOLVED: To provide a device for testing an extremely large number of integrated circuit chips on a product wafer at the same time or for barn-in. SOLUTION: A device includes a probe 44 mounted on a first board 22 and a tester chip 28 mounted on a second board 24 and provides an electrical connector 78 for connecting the two boards. A tester chip 28 is provided for distributing power in product chips or testing the product chips. A probe 44 and a wiring of a thin film 42 whereon the probe 44, etc., are mounted are exclusively used for a pad-foot printing of a specified wafer 26 to be probed. Both a base 40 of the first board 22 and the second board 24 are maintained equally with respect to all wafers in a product family.
-
-
Search Results
3
records
(took 0.017 seconds)
