1.
    发明专利
    未知

    公开(公告)号:DE3888955D1

    公开(公告)日:1994-05-11

    申请号:DE3888955

    申请日:1988-11-23

    Applicant: IBM

    Abstract: The electrical insulation (22) surrounding the conductive coil (20) in a thin film magnetic head (11) comprises a photosensitive resin which has been crosslinked by a thermally activated crosslinking agent or promotor. The addition of the thermally activated crosslinking agent or promotor greatly reduces both the cure temperature and cure time and results in enhanced dimensional stability without any deleterious effects.

    2.
    发明专利
    未知

    公开(公告)号:DE3888955T2

    公开(公告)日:1994-11-10

    申请号:DE3888955

    申请日:1988-11-23

    Applicant: IBM

    Abstract: The electrical insulation (22) surrounding the conductive coil (20) in a thin film magnetic head (11) comprises a photosensitive resin which has been crosslinked by a thermally activated crosslinking agent or promotor. The addition of the thermally activated crosslinking agent or promotor greatly reduces both the cure temperature and cure time and results in enhanced dimensional stability without any deleterious effects.

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