公开(公告)号：GB2283863A

公开(公告)日：1995-05-17

申请号：GB9323646

申请日：1993-11-16

Applicant: IBM

Inventor： DOWNIE ALAN PETER ,  GALLAGHER PETER ,  GARRITY JOHN JOSEPH ,  ROBERTSON BRIAN LESLIE

IPC: H05K1/11 ,  H01L25/04 ,  H01L25/18 ,  H05K1/14 ,  H05K3/00 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K3/42 ,  H05K1/18

Abstract: A direct chip attach module (DCAM) 10 comprises one or more electronic components 30 bonded to a printed circuit on a substrate. The DCAM is bonded to an electronic circuit assembly by means of connection pads 50 formed on the edge of the DCAM substrate. This enables easy visual inspection of solder joints between the DCAM and the assembly. DCAM substrates 70 are provided in panel form and vias 50 are drilled and plated at predetermined connection points. The DCAM is then excised from the panel and the cut vias provide connection pads 50 on the edge of the substrate.