公开(公告)号：GB2283863A

公开(公告)日：1995-05-17

申请号：GB9323646

申请日：1993-11-16

Applicant: IBM

Inventor： DOWNIE ALAN PETER ,  GALLAGHER PETER ,  GARRITY JOHN JOSEPH ,  ROBERTSON BRIAN LESLIE

IPC: H05K1/11 ,  H01L25/04 ,  H01L25/18 ,  H05K1/14 ,  H05K3/00 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K3/42 ,  H05K1/18

Abstract: A direct chip attach module (DCAM) 10 comprises one or more electronic components 30 bonded to a printed circuit on a substrate. The DCAM is bonded to an electronic circuit assembly by means of connection pads 50 formed on the edge of the DCAM substrate. This enables easy visual inspection of solder joints between the DCAM and the assembly. DCAM substrates 70 are provided in panel form and vias 50 are drilled and plated at predetermined connection points. The DCAM is then excised from the panel and the cut vias provide connection pads 50 on the edge of the substrate.

公开(公告)号：GB2353745A

公开(公告)日：2001-03-07

申请号：GB9919166

申请日：1999-08-14

Applicant: IBM

Inventor： ROBERTSON BRIAN LESLIE ,  LEES STUART

IPC: H01L21/00 ,  H05K13/04

Abstract: Apparatus for severing the connection made by solder balls 112 to remove a ball grid array package 102 from a substrate 100, comprises a flexible loop of diamond grit wire 202 running over at least two tension pulleys 206 and a drive pulley 204, the tension pulleys being located so as to position the cutting member between the ball grid array package and the substrate. Alternatively an adjustment mechanism may be provided to locate the abrading wire.