公开(公告)号：GB2344550A

公开(公告)日：2000-06-14

申请号：GB9826943

申请日：1998-12-09

Applicant: IBM

Inventor： GARRITY JOHN JOSEPH ,  MCMORRAN JOHN JAMES HANNAH

IPC: B23K1/00 ,  G01R31/04 ,  G01R31/304 ,  H05K1/02 ,  H05K1/11 ,  H05K3/34

Abstract: A ball grid array electronic package is attached to a substrate by means of solder balls and solder paste. Connection is made between a contact on the ball grid array and a solder ball by means of a first joining medium, such as a solder paste. Connection is made between a solder ball and a contact arranged on the substrate by means of a second joining medium. The contact arranged on the substrate is substantially quadrilateral in shape, and preferably substantially square in shape. A method of soldering such an electronic package and substrate the joints are checked by X-Ray which is facilitated by the contact pad shape.

公开(公告)号：GB2283863A

公开(公告)日：1995-05-17

申请号：GB9323646

申请日：1993-11-16

Applicant: IBM

Inventor： DOWNIE ALAN PETER ,  GALLAGHER PETER ,  GARRITY JOHN JOSEPH ,  ROBERTSON BRIAN LESLIE

IPC: H05K1/11 ,  H01L25/04 ,  H01L25/18 ,  H05K1/14 ,  H05K3/00 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K3/42 ,  H05K1/18

Abstract: A direct chip attach module (DCAM) 10 comprises one or more electronic components 30 bonded to a printed circuit on a substrate. The DCAM is bonded to an electronic circuit assembly by means of connection pads 50 formed on the edge of the DCAM substrate. This enables easy visual inspection of solder joints between the DCAM and the assembly. DCAM substrates 70 are provided in panel form and vias 50 are drilled and plated at predetermined connection points. The DCAM is then excised from the panel and the cut vias provide connection pads 50 on the edge of the substrate.