公开(公告)号：JPH06314890A

公开(公告)日：1994-11-08

申请号：JP5741094

申请日：1994-03-28

Applicant: IBM

Inventor： EBUAN EZURA DEBUITSUDOSON ,  DEBUITSUDO ANDORIYUU RUISU ,  JIEEN MAAGARETSUTO SHIYOU ,  ARUFURETSUDO BUIIBETSUKU ,  JIYANIYUSU SUTANISUROU UIRUJIN

IPC: H05K3/36 ,  H01L25/065 ,  H05K1/05 ,  H05K1/14 ,  H05K3/34 ,  H05K3/46 ,  H05K7/14

Abstract: PURPOSE: To provide a three-dimensional structure for a high-performance computer and its manufacturing method. CONSTITUTION: There is provided with a high-density packaging of a large number of integrated circuit chips for the minimum communication distance and the maximum clock speed of a computer. A packaging structure is formed by a plurality of subassemblies 6 and 7. The subassemblies 6 and 7 are formed by a substrate 8 with at least one integrated circuit device on at least one surface. A second substrate 18 is provided between adjacent subassemblies. Electrical interconnection means 29 and 32' for electrically interconnecting contact parts 28 and 37' on the subassemblies 6 and 8 to contact parts 32 and 36 on the second substrate 18 exist. The electrical interconnection means is, for example, solder mound and wire bond.