公开(公告)号：JPS61251154A

公开(公告)日：1986-11-08

申请号：JP445286

申请日：1986-01-14

Applicant: IBM

Inventor： HARORUDO HENRII HAADO ,  ROORENSU YAKOBOUITSUTSU ,  JIEEN MAAGARETSUTO SHIYOU

IPC: H01L21/76 ,  H01L21/027 ,  H01L21/31 ,  H01L21/312 ,  H01L21/762

公开(公告)号：JPH06298934A

公开(公告)日：1994-10-25

申请号：JP24968992

申请日：1992-09-18

Applicant: IBM

Inventor： MARII ANJIEROPUROSU ,  KURAUDEIUSU FUEEGAA ,  JIEFURII DONARUDO JIEROOMU ,  JIEEN MAAGARETSUTO SHIYOU

IPC: C08G73/10 ,  G03F7/004 ,  G03F7/038

公开(公告)号：JPS61226747A

公开(公告)日：1986-10-08

申请号：JP22793685

申请日：1985-10-15

Applicant: IBM

Inventor： EDOWAADO DAAKO BABITSUCHI ,  MAIKERU HATSUTOZAKISU ,  JIYON JIYOSEFU RIYUUTOKISU ,  JIYURI ROSUTEISURABU PARASUKUZ ,  JIEEN MAAGARETSUTO SHIYOU

IPC: G03C5/00 ,  C08F2/48 ,  C08F290/00 ,  C08F299/00 ,  C08F299/08 ,  C08K5/07 ,  C08L83/07 ,  G03F7/00 ,  G03F7/004 ,  G03F7/038 ,  G03F7/075 ,  H01L21/30

公开(公告)号：JPH06314890A

公开(公告)日：1994-11-08

申请号：JP5741094

申请日：1994-03-28

Applicant: IBM

Inventor： EBUAN EZURA DEBUITSUDOSON ,  DEBUITSUDO ANDORIYUU RUISU ,  JIEEN MAAGARETSUTO SHIYOU ,  ARUFURETSUDO BUIIBETSUKU ,  JIYANIYUSU SUTANISUROU UIRUJIN

IPC: H05K3/36 ,  H01L25/065 ,  H05K1/05 ,  H05K1/14 ,  H05K3/34 ,  H05K3/46 ,  H05K7/14

Abstract: PURPOSE: To provide a three-dimensional structure for a high-performance computer and its manufacturing method. CONSTITUTION: There is provided with a high-density packaging of a large number of integrated circuit chips for the minimum communication distance and the maximum clock speed of a computer. A packaging structure is formed by a plurality of subassemblies 6 and 7. The subassemblies 6 and 7 are formed by a substrate 8 with at least one integrated circuit device on at least one surface. A second substrate 18 is provided between adjacent subassemblies. Electrical interconnection means 29 and 32' for electrically interconnecting contact parts 28 and 37' on the subassemblies 6 and 8 to contact parts 32 and 36 on the second substrate 18 exist. The electrical interconnection means is, for example, solder mound and wire bond.

公开(公告)号：JPS60147732A

公开(公告)日：1985-08-03

申请号：JP19276284

申请日：1984-09-17

Applicant: IBM

Inventor： EDOWAADO DAAKO BABITSUCHI ,  MAIKERU HATOZAKISU ,  JIYURIJI ROSUTEISURABU PARASUZ ,  JIEEN MAAGARETSUTO SHIYOU

IPC: G03C1/72 ,  G03F7/004 ,  G03F7/023 ,  G03F7/038 ,  G03F7/075 ,  H01L21/027

公开(公告)号：JPS54121114A

公开(公告)日：1979-09-20

申请号：JP1511679

申请日：1979-02-14

Applicant: IBM

Inventor： BENJIYAMIN JIYON KIYANABERO ,  MAIKURU HATSUZAKISU ,  JIEEN MAAGARETSUTO SHIYOU

IPC: G03C1/72 ,  G03F7/00 ,  G03F7/022 ,  G03F7/30 ,  G03F7/32 ,  G03F7/38 ,  G03F7/40 ,  H01L21/027 ,  H01L21/30

公开(公告)号：JPH06184601A

公开(公告)日：1994-07-05

申请号：JP11119393

申请日：1993-04-15

Applicant: IBM

Inventor： SANGU KUUON KANGU ,  SANPASU PURUSHIYOSAMAN ,  JIYON JIEIMUSU RITSUKO ,  JIEEN MAAGARETSUTO SHIYOU ,  SABUHASHIYU RAKUSUMAN SHINDO

IPC: B01F3/18 ,  B22F1/00 ,  B22F9/04 ,  C22C1/10 ,  H05K1/09

Abstract: PURPOSE: To provide a method of producing a powder of metal particles containing grain growth control additives. CONSTITUTION: A powder of metal particles, such as copper particles, is mixed with a powder of additive particles, such as alumina particles. The resultant mixture is subjected to high energy ball milling to obtain the metal particles where the additive particles are substantially uniformly dispersed. The ball milled powder contains elongated high aspect ratio particles. The high aspect ratio particles are reduced in size by jet impact milling. The jet impact milled powder has particles of sufficiently small size to fill a via between metallization layers constituting the green ceramic precursor to a ceramic substrate. When a combination of ceramic precursor and conductor forming paste is sintered, the grain growth control additive results in a substantially void free via filled with metal having a fine grain morphology.

公开(公告)号：JPS62263645A

公开(公告)日：1987-11-16

申请号：JP5703587

申请日：1987-03-13

Applicant: IBM

Inventor： DONARUDO JIIN MAKUBURAIDO ,  JIEEN MAAGARETSUTO SHIYOU

IPC: G03F7/075 ,  H01L21/60 ,  H05K3/34

公开(公告)号：JPS5662247A

公开(公告)日：1981-05-28

申请号：JP14068980

申请日：1980-10-09

Applicant: IBM

Inventor： ARI ABUIRAMU ,  DONARUDO KURIFUOODO HOFUAA ,  FURANKU BENJIYAMIN KOOFUMAN ,  SUTEIIBUN ROBAATO KURAMAA ,  JIEEN MAAGARETSUTO SHIYOU ,  MAIKERU HATSUZAKISU ,  FURETSUCHIYAA JIYOONZU

IPC: G03F7/004 ,  G03C1/675 ,  G03C5/00 ,  G03C5/16 ,  G03F7/038 ,  H01L21/027 ,  H01L21/302