公开(公告)号：JPH06314890A

公开(公告)日：1994-11-08

申请号：JP5741094

申请日：1994-03-28

Applicant: IBM

Inventor： EBUAN EZURA DEBUITSUDOSON ,  DEBUITSUDO ANDORIYUU RUISU ,  JIEEN MAAGARETSUTO SHIYOU ,  ARUFURETSUDO BUIIBETSUKU ,  JIYANIYUSU SUTANISUROU UIRUJIN

IPC: H05K3/36 ,  H01L25/065 ,  H05K1/05 ,  H05K1/14 ,  H05K3/34 ,  H05K3/46 ,  H05K7/14

Abstract: PURPOSE: To provide a three-dimensional structure for a high-performance computer and its manufacturing method. CONSTITUTION: There is provided with a high-density packaging of a large number of integrated circuit chips for the minimum communication distance and the maximum clock speed of a computer. A packaging structure is formed by a plurality of subassemblies 6 and 7. The subassemblies 6 and 7 are formed by a substrate 8 with at least one integrated circuit device on at least one surface. A second substrate 18 is provided between adjacent subassemblies. Electrical interconnection means 29 and 32' for electrically interconnecting contact parts 28 and 37' on the subassemblies 6 and 8 to contact parts 32 and 36 on the second substrate 18 exist. The electrical interconnection means is, for example, solder mound and wire bond.

公开(公告)号：JPH09103732A

公开(公告)日：1997-04-22

申请号：JP23449696

申请日：1996-09-04

Applicant: IBM

Inventor： ERIZABESU FUOSUTAA ,  JIEFURII SHII HEDORITSUKU ,  ROBAATO EMU JIYATSUPU ,  KONSUTANTEINOSU PAPATOMASU ,  SUTEFUAN ERU TEISUDEERU ,  ARUFURETSUDO BUIIBETSUKU

IPC: B05C11/10 ,  B05C5/02 ,  B05C5/04 ,  B29B15/12

Abstract: PROBLEM TO BE SOLVED: To precisely and easily supply a fluid to a substrate by providing a head member having plural fluid injectors and a means for controlling the amt. of the fluid to be supplied to a workpiece. SOLUTION: Two parallel head members 11 and 11' each having plural fluid injectors are provided with the means 23 and 23' to seal the second fluids 25 and 25' at a second pressure almost equal to or higher than the pressure of the first fluids 15 and 15'. The first fluids 15 and 15', e.g. an epoxy resin soln., are supplied to the specified positions 17 and 17' on a glass substrate 19 as the workpiece. Namely, the substrate 19 is coated with the fluids before being used as the material for a printed circuit board. At this time, the second fluids 25 and 25', e.g. nitrogen, are supplied to the specified positions 17 and 17' to limit the first fluids 15 and 15' and collided with almost the central position of the feeder 10. The fluids are supplied to the substrate 19 precisely and easily in this way.

公开(公告)号：JPH08295737A

公开(公告)日：1996-11-12

申请号：JP9666096

申请日：1996-04-18

Applicant: IBM

Inventor： FUAN II AYARA ESUKIRIN ,  JIEEMUZU ERU HEDORITSUKU ,  JIEFURII SHII HEDORITSUKU ,  SUSHIYUNMA IRUBUANTEI ,  IIBUA II SHIMONII ,  ARUFURETSUDO BUIIBETSUKU

IPC: C08J5/18 ,  C08G77/12 ,  C08G77/20 ,  C08G77/22 ,  C08G77/38 ,  C08K3/00 ,  C08L83/05 ,  C08L83/07 ,  H01L23/36

公开(公告)号：JPH07235374A

公开(公告)日：1995-09-05

申请号：JP29632394

申请日：1994-11-30

Applicant: IBM

Inventor： JIEFURII KAATEISU HEDORITSUKU ,  DEEBUITSUDO ANDORIYUU RUISU ,  JIEEN MAAGARETSUTO SHIYOO ,  ARUFURETSUDO BUIIBETSUKU ,  SUTANREE JIYOOZEFU HOWAITOHEA

IPC: H05B6/80 ,  H05B6/62 ,  H05B6/78

Abstract: PURPOSE: To heat a sheet-like material web uniformly so as to removed surface volatile solvent by passing a web whose thickness is smaller than the wavelength of a microwave standing wave through a microwave standing wave area in which the wavelengths are shifted by 1/4 wavelength as causing carrier gas to flow. CONSTITUTION: Microwave standing waves 3, 4 of predetermined frequencies which are shifted by 1/4 wavelength along the moving direction 19 of a web 1 are supplied to two respective conduction rods in a processing step 2. By an electric field based on the same the web 1 having a smaller thickness than the wavelength of the microwave frequency is heated in the step. By standing waves 3, 4 shifted by 1/4 wavelength the standing waves 3, 4 are not coupled with each other so that the web is uniformly heated and volatile solvent on the surface of the web is excellently removed by carrier gas.

公开(公告)号：JPH09137059A

公开(公告)日：1997-05-27

申请号：JP24298796

申请日：1996-09-13

Applicant: IBM

Inventor： JIEFURII SHII HEDORITSUKU ,  KONSUTANCHINOSU PAPATOMASU ,  SUCHIIBUN ERU TEISUDEERU ,  ARUFURETSUDO BUIIBETSUKU ,  JIEFURII DEII JIEROOMU ,  BUOIYA AARU MARUKOBUITSUCHI ,  TOMASU EICHI RUISU ,  SUCHIIBUN JIEI FUAANISU

IPC: G03F7/027 ,  C08L79/00 ,  G03F7/029 ,  G03F7/38 ,  H01L21/027

公开(公告)号：JPH0782490A

公开(公告)日：1995-03-28

申请号：JP21315194

申请日：1994-08-15

Applicant: IBM

Inventor： JIEFURII TOMASU GOTOROO ,  JIEFURII KAACHISU HEDORITSUKU ,  KONSUTANTEINOSU PAPATOMASU ,  NIRANJIYAN MOOHANRAARU PATERU ,  ARUFURETSUDO BUIIBETSUKU ,  UIRIAMU JIYOOZEFU

IPC: C08L27/12 ,  C08G59/30 ,  C08L63/00 ,  C08L71/00 ,  C08L71/08 ,  C08L71/10 ,  C08L87/00 ,  C08L101/00 ,  C08L101/02 ,  H05K1/03

公开(公告)号：JPH05129249A

公开(公告)日：1993-05-25

申请号：JP9516892

申请日：1992-04-15

Applicant: IBM

Inventor： MAAKU JIEFUREI SHIYAATO ,  ARUFURETSUDO BUIIBETSUKU

IPC: H01L21/302 ,  C08J7/12 ,  C23C18/20 ,  C23C18/22 ,  H01L21/3065 ,  H01L21/324 ,  H05H1/00 ,  H05K3/18 ,  H05K3/38

Abstract: PURPOSE: To overcome oxidation caused in an exposure polymer material due to such a dry process as an etching method, using an oxygen atmosphere. CONSTITUTION: A polymer base is exposed to a plasma containing oxygen and then is exposed to a reducing atmosphere at approximately 120 deg.C or higher. The reduction treatment inverts the chemical effect of the polymer surface due to the operation of an oxidation plasma, thus reproducing an original electrical activity on the surface of a certain type of polymer.