公开(公告)号：GB2601964A

公开(公告)日：2022-06-15

申请号：GB202203040

申请日：2020-08-20

Applicant: IBM

Inventor： BRUCE DORIS ,  EILEEN GALLIGAN ,  NATHAN MARCHACK ,  POUYA HASHEMI

IPC: H01L43/08

Abstract: A dielectric material structure is formed laterally adjacent to a bottom portion of a bottom electrode metal-containing portion that extends upward from an electrically conductive structure that is embedded in an interconnect dielectric material layer. The physically exposed top portion of the bottom electrode metal-containing portion is then trimmed to provide a bottom electrode of unitary construction (i.e., a single piece) that has a lower portion having a first diameter and an upper portion that has a second diameter that is greater than the first diameter. The presence of the dielectric material structure prevents tilting and/or bowing of the resultant bottom electrode. Thus, a stable bottom electrode is provided.