Computing devices containing magnetic Josephson Junctions with embedded magnetic field control element

    公开(公告)号:GB2605096A

    公开(公告)日:2022-09-21

    申请号:GB202208597

    申请日:2020-11-18

    Applicant: IBM

    Abstract: A within-chip magnetic field control device is formed in proximity to a Josephson Junction (JJ) structure. The within-chip magnetic field control device includes wiring structures that are located laterally adjacent to the JJ structure. In some embodiments, the magnetic field control device also includes, in addition to the wiring structures, a conductive plate that is connected to the wiring structures and is located beneath the JJ structure. Use of electrical current through the wiring structures induces, either directly or indirectly, a magnetic field into the JJ structure. The strength of the field can be modulated by the amount of current passing through the wiring structures. The magnetic field can be turned off as needed by ceasing to allow current to flow through the wiring structures.

    Tapered VIA structure in MTJ devices

    公开(公告)号:GB2594868B

    公开(公告)日:2022-08-17

    申请号:GB202110417

    申请日:2019-12-17

    Applicant: IBM

    Abstract: A bottom electrode structure for MRAM or MTJ-based memory cells comprises a taper so that the bottom CD is smaller than the top CD. A process of making a bottom electrode contact structure comprises etching a dielectric layer using a plasma chemistry with an increased degree of polymerization. We obtain a product made by this process.

    Providing supply voltage to a dynamic internal power supply node

    公开(公告)号:GB2577196A

    公开(公告)日:2020-03-18

    申请号:GB201916879

    申请日:2018-05-14

    Applicant: IBM

    Abstract: Circuits and methods are disclosed for providing a supply voltage to a dynamic internal power supply node of a group of other circuits. A circuit includes a first transistor and a second transistor, of different channel types, coupled in parallel to a static power supply that supplies a constant power supply voltage. The circuit further includes a magnetic inductor having a first terminal connected to a common node between the first transistor and the second transistor and a second terminal connected to the dynamic internal power supply node, to supply the dynamic internal power supply node with a boosted voltage having a magnitude greater than a magnitude of the constant power supply voltage by resonating with at least one capacitance coupled to the dynamic internal power supply node.

    Resonant clock circuit with magnetic shield

    公开(公告)号:GB2577210B

    公开(公告)日:2022-05-11

    申请号:GB201917541

    申请日:2018-05-31

    Applicant: IBM

    Abstract: Semiconductor devices and methods relating to the semiconductor devices are provided. A semiconductor device includes a resonant clock circuit. The semiconductor device further includes an inductor. The semiconductor device also includes a magnetic layer formed of a magnetic material disposed in between a portion of the resonant clock circuit and the inductor. Clock signals of the resonant clock circuit are utilized by the magnetic layer.

    Biosensor electrode having three-dimensional structured sensing surfaces

    公开(公告)号:GB2575748A

    公开(公告)日:2020-01-22

    申请号:GB201915102

    申请日:2018-03-20

    Applicant: IBM

    Abstract: A sensor includes a sensing circuit (116, 126) and a probe (112, 122) communicatively coupled to the sensing circuit (116, 126). The probe (112, 122) includes a three-dimensional (3D) sensing surface coated with a recognition element and configured to, based at least in part on the 3D sensing surface interacting with a predetermined material, generate a first measurement. In some embodiments, the 3D sensing surface is shaped as a pyramid, a cone, or a cylinder to increase the sensing surface area over a two- dimensional (2D) sensing surface. In some embodiments, the 3D sensing facilitates penetration of the 3D sensing surface through the wall of the biological cell (142A).

    Multilayered bottom electrode for MTJ-containing devices

    公开(公告)号:GB2602738B

    公开(公告)日:2023-09-27

    申请号:GB202203398

    申请日:2020-08-18

    Applicant: IBM

    Abstract: A multilayered bottom electrode for a magnetic tunnel junction (MTJ) containing device is provided that includes, from bottom to top, a base segment having a first diameter and composed of a remaining portion of a first bottom electrode metal-containing layer, a middle segment having a second diameter and composed of a remaining portion of a second bottom electrode metal-containing layer, and an upper segment having a third diameter and composed of a remaining portion of a third bottom electrode metal-containing layer, wherein the first diameter is greater than the second diameter, and the third diameter is equal to, or less than, the second diameter. The wider base segment of each multilayered bottom electrode prevents tilting and/or bowing of the resultant bottom electrode. Thus, a stable bottom electrode is provided.

    Reinforced single element bottom electrode for MTJ-containing devices

    公开(公告)号:GB2601964A

    公开(公告)日:2022-06-15

    申请号:GB202203040

    申请日:2020-08-20

    Applicant: IBM

    Abstract: A dielectric material structure is formed laterally adjacent to a bottom portion of a bottom electrode metal-containing portion that extends upward from an electrically conductive structure that is embedded in an interconnect dielectric material layer. The physically exposed top portion of the bottom electrode metal-containing portion is then trimmed to provide a bottom electrode of unitary construction (i.e., a single piece) that has a lower portion having a first diameter and an upper portion that has a second diameter that is greater than the first diameter. The presence of the dielectric material structure prevents tilting and/or bowing of the resultant bottom electrode. Thus, a stable bottom electrode is provided.

    Resonant clock circuit with magnetic shield

    公开(公告)号:GB2577210A

    公开(公告)日:2020-03-18

    申请号:GB201917541

    申请日:2018-05-31

    Applicant: IBM

    Abstract: Semiconductor devices and methods relating to the semiconductor devices are provided. A semiconductor device includes a resonant clock circuit. The semiconductor device further includes an inductor. The semiconductor device also includes a magnetic layer formed of a magnetic material disposed in between a portion of the resonant clock circuit and the inductor. Clock signals of the resonant clock circuit are utilized by the magnetic layer.

    Magnetic inductor stacks with multilayer isolation layers

    公开(公告)号:GB2566664A8

    公开(公告)日:2019-03-27

    申请号:GB201901265

    申请日:2017-06-13

    Applicant: IBM

    Abstract: A magnetic laminating structure includes alternating layers of a magnetic material (112) and a multilayered insulating material, wherein the multilayered insulating material is intermediate adjacent magnetic material layers and comprises a first insulating layer (114A) abutting at least on additional insulating layer (114B), and wherein the first insulating layer (114A) and the at least one additional insulating layer (114B) comprise different dielectric materials and/or are formed by a different deposition process.

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