公开(公告)号：DE3266507D1

公开(公告)日：1985-10-31

申请号：DE3266507

申请日：1982-06-02

Applicant: IBM

Inventor： ABOLAFIA OSCAR ROBERT ,  AMEEN JOSEPH GEORGE ,  ELMORE GLENN VANNESS

IPC: C23F1/26 ,  H05K3/06 ,  C23F1/00 ,  C09K13/06

Abstract: An aqueous acidic composition suitable for etching which contains an acid and a thiourea compound, and use thereof.

公开(公告)号：DE2425223A1

公开(公告)日：1975-01-23

申请号：DE2425223

申请日：1974-05-24

Applicant: IBM

Inventor： ELMORE GLENN VANNESS

IPC: H05K3/18 ,  C23C18/16 ,  C23C18/22 ,  C23C18/28 ,  C23C18/31 ,  C23C18/40 ,  H05K3/38 ,  H01B5/14

Abstract: 1421681 Manufacture of printed circuit boards INTERNATIONAL BUSINESS MACHINES CORP 14 May 1974 [2 July 1973] 21182/74 Heading C7F A dielectric substrate is prepared for electroless plating with Cu to form printed circuit boards by cleaning an Al foil in NaOH soln, rinsing, treating in HNO 3 , rinsing, treating in a solution of ZnO, CuO and NaOH to form a micro-modular coating on the foil, rinsing in deionized water and drying, laminating the treated Al foil to the substrate, immersing the laminated substrate in an etching bath to remove Zn, Al and, if desired Cu to leave a replicated surface of the nodular structure on the substrate which after catalyzing is receptive to the electroless plating of Cu, and optionally electrolytic plating of Cu. Prior to plating the substrate may be sensitized and activated in separate steps, or immersed in a Sn-Pd catalyst solution. The foil is 0.5-5 mils thick, and the substrate is preferably a thermo-plastic or thermosetting resin, e.g. copolymers of phenol, resorcinol, cresol, polyolefins, e.g. polypropylene, ABS, polycarbonates, polysulphones, and fluorinated ethylene propylene (FEP).