3.
    发明专利
    未知

    公开(公告)号:DE2258880A1

    公开(公告)日:1973-06-20

    申请号:DE2258880

    申请日:1972-12-01

    Applicant: IBM

    Abstract: 1405943 Photosensitive epoxy resin composition INTERNATIONAL BUSINESS MACHINES CORP 25 Oct 1972 [17 Dec 1971] 49108/72 Heading C3B [Also in Divisions G2 and H1] A positive photoresist composition comprises (I) an epoxy resin, (II) a tertiary amine curing agent, (III) a halogenated hydrocarbon sensitizer and (IV) a solvent. I may be a diglycidyl ether of bisphenol A, polyglycidyl ethers of phenol formaldehyde condensates, a polyglycidyl ether of tetraphenylene ethane or a diglycidyl ether of bisphenol A. II may be N,N,N 1 ,N 1 - tetramethyl - 1,3 - butanediamine, benzyldimethylamine, 2 - dimethylamino - 2 - hydroxypropane, 2 - (dimethylaminomethyl)- phenol or 2,4,6 - tris - (dimethylaminomethyl)- phenol. A preferred III is carbon tetrabromide. IV may be 2-methoxyethanol, methyl ethyl ketone, chloroform or mixtures thereof. Uses.-Printed circuitry (see Divisions H1 and G2).

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