公开(公告)号：JPH11237406A

公开(公告)日：1999-08-31

申请号：JP31677698

申请日：1998-10-02

Applicant: IBM

Inventor： BEAMAN BRIAN S ,  KEITH EDWARD VOGEL ,  PAUL ALFRED LARO ,  EUGENE JOHN O'SULLIVAN ,  SHIH DA-YUAN

IPC: G01R31/26 ,  G01R1/06 ,  G01R1/067 ,  G01R1/073 ,  H01L21/66 ,  H05K3/24 ,  H05K3/32

Abstract: PROBLEM TO BE SOLVED: To manufacture a high-density probe with rubbing operation that is controlled appropriately, by providing a plurality of plated bumps being mounted onto a substrate with specific wiring as a contact location to a plurality of solder balls. SOLUTION: A probe 30 for testing while being in contact with a solder ball connection 21 such as an integrated circuit 20 is mounted to a test substrate 11 such as ceramic and silicon wafers with fan-out wiring. The probe 30 is formed, for example, by first allowing a conductive plate base that is formed by sputtering Cu or the like to an adhesive layer where Cr or the like is sputtered to adhere to a surface 10 of the substrate 11. A specific pattern is formed on the plated base using photo resist or the like, and Cu or the like is electrically plated to the opening. Pd or the like covers a structure that is obtained by eliminating the resist and the plated base under it by such method as electroless plating, thus obtaining the probe 30 where the hardness and deterioration resistance of a contact region are improved.