公开(公告)号：JPH11317476A

公开(公告)日：1999-11-16

申请号：JP31677598

申请日：1998-10-02

Applicant: IBM

Inventor： BEAMAN BRIAN S ,  KEITH EDWARD VOGEL ,  PAUL ALFRED LARO ,  SHIH DA-YUAN

IPC: H01R43/02 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  H01L21/00 ,  H01L21/48 ,  H01L21/60 ,  H01L21/607 ,  H01L23/32

Abstract: PROBLEM TO BE SOLVED: To provide a process for bonding wires to an electronic circuit device, attached one end of each wire onto a surface of the device and extend the other end in the direction opposite to the surface of the device. SOLUTION: This process includes a step for providing a surface having places where a plurality of wires can be bonded, a step to bond a wire 16 to each of the wire-bondable places by using a wire capillary tool 15, a step for controlling the position of the capillary tool 15 in relation go the surface, and a step for forming a wire in a predetermined form by moving the capillary tool 15 relative to the surface, when the capillary tool 15 is moved away from the surface after a wire 16 has been bonded to the wire-bondable place.

公开(公告)号：JPH11237406A

公开(公告)日：1999-08-31

申请号：JP31677698

申请日：1998-10-02

Applicant: IBM

Inventor： BEAMAN BRIAN S ,  KEITH EDWARD VOGEL ,  PAUL ALFRED LARO ,  EUGENE JOHN O'SULLIVAN ,  SHIH DA-YUAN

IPC: G01R31/26 ,  G01R1/06 ,  G01R1/067 ,  G01R1/073 ,  H01L21/66 ,  H05K3/24 ,  H05K3/32

Abstract: PROBLEM TO BE SOLVED: To manufacture a high-density probe with rubbing operation that is controlled appropriately, by providing a plurality of plated bumps being mounted onto a substrate with specific wiring as a contact location to a plurality of solder balls. SOLUTION: A probe 30 for testing while being in contact with a solder ball connection 21 such as an integrated circuit 20 is mounted to a test substrate 11 such as ceramic and silicon wafers with fan-out wiring. The probe 30 is formed, for example, by first allowing a conductive plate base that is formed by sputtering Cu or the like to an adhesive layer where Cr or the like is sputtered to adhere to a surface 10 of the substrate 11. A specific pattern is formed on the plated base using photo resist or the like, and Cu or the like is electrically plated to the opening. Pd or the like covers a structure that is obtained by eliminating the resist and the plated base under it by such method as electroless plating, thus obtaining the probe 30 where the hardness and deterioration resistance of a contact region are improved.