公开(公告)号：JPH098447A

公开(公告)日：1997-01-10

申请号：JP14470596

申请日：1996-06-06

Applicant: IBM

Inventor： DALAL HORMAZDYAR MINOCHER ,  FALLON KENNETH MICHAEL ,  GAUDENZI GENE JOSEPH

IPC: H01L21/60 ,  H01L23/485 ,  H05K1/14 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To manufacture an organic laminated circuit card for direct chip mounting by a method wherein a device carrier is electrically connected with a device through a solder ball having a cap, which consists of a low-melting point material which forms an eutectic alloy. SOLUTION: A solder ball 38 is fixed on a ball limiting metallized layer 48. An internal metal wiring 32 conducts the electrical connection between an IC chip 30 and a cap 41. The low-melting point metal cap 41 consists of one kind of a metal selected from a group consisting of bismuth, indium, tin or their alloy. The ball 38 consists of one kind of an alloy selected from a group consisting of a high-melting point solder and a low-melting point solder or C4. It is necessary that the material for the cap 41 is a metal which forms an eutectic alloy. After the chip 30 having the cap 41 on the ball 38 is fixed on a circuit card, the chip 41 is reflowed to form the eutective alloy and the ball 38 is bonded to a copper wiring 20.

公开(公告)号：MY134089A

公开(公告)日：2007-11-30

申请号：MYPI0504802

申请日：1996-07-11

Applicant: IBM

Inventor： FALLON KENNETH MICHAEL ,  COZ CHRISTIAN ROBERT LE ,  PIERSON MARK VINCENT

IPC: H01L23/48 ,  B23K1/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L23/485 ,  H01L23/498 ,  H01L29/40 ,  H05K3/32 ,  H05K3/34

Abstract: A SUBSTRATE (602) IS PROVIDED WITH VIAS COMMUNICATING WITH SURFACE CONTACTS OR BUMPS (630, 682). JOINING MATERIAL PASTE (1076, 1124) IS FORCED THROUGH HOLES IN A SCREEN ONTO AN AREA ARRAY OF THE CONTACTS ON THE SUBSTRATE THEN THE SCREEN IS BIASED AGAINST THE SUBSTRATE AS THE PASTE IS HEATED AND COOLED TO TRANSFER THE JOINING MATERIAL ONTO THE CONTACTS. ALTERNATELY, JOINING MATERIAL PASTE IS FORCED INTO THE SCREEN AND THEN A SUBSTRATE IS PLACED ONTO THE SCREEN WITH AN AREA ARRAY OF BUMP CONTACTS OF THE SUBSTRATE IN CONTACT WITH THE SOLDER PASTE, AND THEN THE PASTE IS HEATED AND COOLED TO TRANSFER THE MATERIAL ONTO THE BUMPS. THE JOINING MATERIAL MAY BE A SOLDER PASTE, CONDUCTIVE ADHESIVE PASTE, OR TRANSIENT LIQUID BOND PASTE.THE SUBSTRATE MAY BE A SEMICONDUCTOR CHIP SUBSTRATE, FLEXIBLE OR RIGID ORGANIC SUBSTRATE, OR A METAL SUBSTRATE COATED TO FORM A DIELECTRIC SURFACE. ALSO, THE SUBSTRATE MAY BE A COMPUTER CHIP CARRIER SUBSTRATE OR A CIRCUIT BOARD SUBSTRATE.THE PROCESS MAY BE USED TO PRODUCE FLIP CHIPS (600, 680, 734, 862), BALL GRID ARRAY MODULES, COLUMN GRID ARRAY MODULES, CIRCUIT BOARDS (694,904), AND ATTACHMENT STRUCTURES OF THE PRECEDING COMPONENTS INCLUDING INFORMATION HANDLING SYSTEMS.(FIG 1)

公开(公告)号：MY127628A

公开(公告)日：2006-12-29

申请号：MYPI9602864

申请日：1996-07-11

Applicant: IBM

Inventor： FALLON KENNETH MICHAEL ,  COZ CHRISTIAN ROBERT LE ,  PIERSON MARK VINCENT

IPC: H01L21/288 ,  B23K1/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L23/485 ,  H01L23/498 ,  H05K3/32 ,  H05K3/34

Abstract: A SUBSTRATE (602) IS PROVIDED WITH VIAS COMMUNICATING WITH SURFACE CONTACTS OR BUMPS (630, 682). JOINING MATERIAL PASTE (1076, 1124) IS FORCED THROUGH HOLES IN A SCREEN ONTO AN AREA ARRAY OF THE CONTACTS ON THE SUBSTRATE THEN THE SCREEN IS BIASED AGAINST THE SUBSTRATE AS THE PASTE IS HEATED AND COOLED TO TRANSFER THE JOINING MATERIAL ONTO THE CONTACTS. ALTERNATELY, JOINING MATERIAL PASTE IS FORCED INTO THE SCREEN AND THEN A SUBSTRATE IS PLACED ONTO THE SCREEN WITH AN AREA ARRAY OF BUMP CONTACTS OF THE SUBSTRATE IN CONTACT WITH THE SOLDER PASTE, AND THEN THE PASTE IS HEATED AND COOLED TO TRANSFER THE MATERIAL ONTO THE BUMPS. THE JOINING MATERIAL MAY BE A SOLDER PASTE; CONDUCTIVE ADHESIVE PASTE, OR TRANSIENT LIQUID BOND PASTE. THE SUBSTRATE MAY BE A SEMICONDUCTOR CHIP SUBSTRATE, FLEXIBLE OR RIGID ORGANIC SUBSTRATE, OR A METAL SUBSTRATE COATED TO FORM A DIELECTRIC SURFACE. ALSO, THE SUBSTRATE MAY BE A COMPUTER CHIP, CHIP CARRIER SUBSTRATE OR A CIRCUIT BOARD SUBSTRATE. THE PROCESS MAY BE USED TO PRODUCE FLIP CHIPS (600, 680, 734, 862), BALL GRID ARRAY MODULES, COLUMN GRID ARRAY MODULES, CIRCUIT BOARDS (694, 904), AND ATTACHMENT STRUCTURES OF THE PRECEDING COMPONENTS INCLUDING INFORMATION HANDLING SYSTEMS. (FIG.1)

公开(公告)号：SG53104A1

公开(公告)日：1998-09-28

申请号：SG1997003744

申请日：1997-10-14

Applicant: IBM

Inventor： DALAL HORMAZDYAR MINOCHER ,  FALLON KENNETH MICHAEL ,  GAUDENZI GENE JOSEPH ,  MILKOVICH CYNTHIA SUSAN

IPC: H01L21/56 ,  H01L21/60 ,  H01L23/498 ,  H01L23/538 ,  H05K1/18 ,  H05K3/00 ,  H05K3/34

Abstract: A structure and method is disclosed for directly attaching a device or package on flexible organic circuit carriers having low cost and high reliability. IC chips with a new solder interconnect structure, comprised of a layer of pure tin, deposited on the top of high melting Pb-Sn solder balls are employed for joining. These methods, techniques and metallurgical structures enables direct attachment of electronic devices of any complexity to any substrate and to any level of packaging hierarchy. Also, devices or packages having other joining technologies, eg. SMT, BGA, TBGA, etc. could be joined onto the flexible circuit carrier.