公开(公告)号：EP1545826A4

公开(公告)日：2009-02-11

申请号：EP03755830

申请日：2003-09-12

Applicant: IBM

Inventor： INTERRANTE MARIO ,  FARCOOQ MUKTA G ,  SABLINSKI WILLIAM EDWARD

IPC: B23K1/00 ,  B23K31/02 ,  B23K35/12 ,  B23K35/14 ,  B23K35/26 ,  B23K35/34 ,  B23K101/40 ,  B23K101/42 ,  C22C13/00 ,  H05K3/34

CPC classification number: B23K1/0016 ,  B23K35/262 ,  B23K2201/36 ,  H01L2224/16225 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/0415 ,  Y02P70/613

Abstract: A lead free solder hierarchy for use in the second level solder connection of electronic components such as joining an electronic module (20) to a circuit board (120). An off-eutectic solder (60) concentration of SnCu or SnAg is used for the module side connection. This off-eutectic solder (60) contains sufficient intermetallics to provide the module side connection with a robust second level assembly and rework process. The off-eutectic composition (60) provides an inter­metallic phase structure in the module side fillet during assembly. The inter­metallic phase structure eliminates problems of tilt and collapse during second level assembly and aids in rework by providing a more cohesive joint allowing removal of the columns (100) from the board (120) without simultaneous removal from the module (20).

公开(公告)号：WO2004026517A3

公开(公告)日：2004-05-06

申请号：PCT/US0329092

申请日：2003-09-12

Applicant: IBM

Inventor： INTERRANTE MARIO ,  FARCOOQ MUKTA G ,  SABLINSKI WILLIAM EDWARD

IPC: B23K1/00 ,  B23K35/14 ,  B23K35/26 ,  B23K101/40 ,  B23K101/42 ,  C22C13/00 ,  H05K3/34 ,  B23K31/02 ,  B23K35/12 ,  B23K35/34

CPC classification number: B23K1/0016 ,  B23K35/262 ,  B23K2201/36 ,  H01L2224/16225 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/0415 ,  Y02P70/613

Abstract: A lead free solder hierarchy for use in the second level solder connection of electronic components such as joining an electronic module (20) to a circuit board (120). An off-eutectic solder (60) concentration of SnCu or SnAg is used for the module side connection. This off-eutectic solder (60) contains sufficient intermetallics to provide the module side connection with a robust second level assembly and rework process. The off-eutectic composition (60) provides an inter­metallic phase structure in the module side fillet during assembly. The inter­metallic phase structure eliminates problems of tilt and collapse during second level assembly and aids in rework by providing a more cohesive joint allowing removal of the columns (100) from the board (120) without simultaneous removal from the module (20).

Abstract translation: 用于电子元件的第二层焊接连接的无铅焊料层次结构，例如将电子模块（20）连接到电路板（120）。 SnCu或SnAg的非共晶焊料（60）浓度用于模块侧连接。 这种非共晶焊料（60）含有足够的金属间化合物以提供模块侧连接，并具有稳健的二级装配和返工工艺。 非共晶组合物（60）在组装期间在模块侧边角中提供金属间相结构。 金属间相结构消除了第二级组装期间的倾斜和塌陷问题，并且通过提供更加粘性的接头允许从板（120）移除柱（100）而无需同时从模块（20）移除而帮助返工。

公开(公告)号：AU2003273330A1

公开(公告)日：2004-04-08

申请号：AU2003273330

申请日：2003-09-12

Applicant: IBM

Inventor： FARCOOQ MUKTA G ,  SABLINSKI WILLIAM EDWARD ,  INTERRANTE MARIO

IPC: B23K1/00 ,  B23K35/14 ,  B23K35/26 ,  B23K101/40 ,  B23K101/42 ,  C22C13/00 ,  H05K3/34

Abstract: A lead free solder hierarchy for use in the second level solder connection of electronic components such as joining an electronic module to a circuit board. An off-eutectic solder concentration of SnCu or SnAg is used for the module side connection. This off-eutectic solder contains sufficient intermetallics to provide the module side connection with a robust second level assembly and rework process. The off-eutectic composition provides an inter-metallic phase structure in the module side fillet during assembly. The inter-metallic phase structure eliminates problems of tilt and collapse during second level assembly and aids in rework by providing a more cohesive joint allowing removal of the columns from the board without simultaneous removal from the module.

公开(公告)号：AU2003273330A8

公开(公告)日：2004-04-08

申请号：AU2003273330

申请日：2003-09-12

Applicant: IBM

Inventor： FARCOOQ MUKTA G ,  INTERRANTE MARIO ,  SABLINSKI WILLIAM EDWARD

IPC: B23K1/00 ,  B23K35/14 ,  B23K35/26 ,  B23K101/40 ,  B23K101/42 ,  C22C13/00 ,  H05K3/34 ,  B23K31/02 ,  B23K35/12 ,  B23K35/34

Abstract: A lead free solder hierarchy for use in the second level solder connection of electronic components such as joining an electronic module to a circuit board. An off-eutectic solder concentration of SnCu or SnAg is used for the module side connection. This off-eutectic solder contains sufficient intermetallics to provide the module side connection with a robust second level assembly and rework process. The off-eutectic composition provides an inter-metallic phase structure in the module side fillet during assembly. The inter-metallic phase structure eliminates problems of tilt and collapse during second level assembly and aids in rework by providing a more cohesive joint allowing removal of the columns from the board without simultaneous removal from the module.