SOLDER HIERARCHY FOR LEAD FREE SOLDER JOINT
    2.
    发明申请
    SOLDER HIERARCHY FOR LEAD FREE SOLDER JOINT 审中-公开
    用于无铅焊接接头的焊料层级

    公开(公告)号:WO2004026517A3

    公开(公告)日:2004-05-06

    申请号:PCT/US0329092

    申请日:2003-09-12

    Applicant: IBM

    Abstract: A lead free solder hierarchy for use in the second level solder connection of electronic components such as joining an electronic module (20) to a circuit board (120). An off-eutectic solder (60) concentration of SnCu or SnAg is used for the module side connection. This off-eutectic solder (60) contains sufficient intermetallics to provide the module side connection with a robust second level assembly and rework process. The off-eutectic composition (60) provides an inter­metallic phase structure in the module side fillet during assembly. The inter­metallic phase structure eliminates problems of tilt and collapse during second level assembly and aids in rework by providing a more cohesive joint allowing removal of the columns (100) from the board (120) without simultaneous removal from the module (20).

    Abstract translation: 用于电子元件的第二层焊接连接的无铅焊料层次结构,例如将电子模块(20)连接到电路板(120)。 SnCu或SnAg的非共晶焊料(60)浓度用于模块侧连接。 这种非共晶焊料(60)含有足够的金属间化合物以提供模块侧连接,并具有稳健的二级装配和返工工艺。 非共晶组合物(60)在组装期间在模块侧边角中提供金属间相结构。 金属间相结构消除了第二级组装期间的倾斜和塌陷问题,并且通过提供更加粘性的接头允许从板(120)移除柱(100)而无需同时从模块(20)移除而帮助返工。

    SOLDER HIERARCHY FOR LEAD FREE SOLDER JOINT

    公开(公告)号:AU2003273330A1

    公开(公告)日:2004-04-08

    申请号:AU2003273330

    申请日:2003-09-12

    Applicant: IBM

    Abstract: A lead free solder hierarchy for use in the second level solder connection of electronic components such as joining an electronic module to a circuit board. An off-eutectic solder concentration of SnCu or SnAg is used for the module side connection. This off-eutectic solder contains sufficient intermetallics to provide the module side connection with a robust second level assembly and rework process. The off-eutectic composition provides an inter-metallic phase structure in the module side fillet during assembly. The inter-metallic phase structure eliminates problems of tilt and collapse during second level assembly and aids in rework by providing a more cohesive joint allowing removal of the columns from the board without simultaneous removal from the module.

    Solder hierarchy for lead free solder joint

    公开(公告)号:AU2003273330A8

    公开(公告)日:2004-04-08

    申请号:AU2003273330

    申请日:2003-09-12

    Applicant: IBM

    Abstract: A lead free solder hierarchy for use in the second level solder connection of electronic components such as joining an electronic module to a circuit board. An off-eutectic solder concentration of SnCu or SnAg is used for the module side connection. This off-eutectic solder contains sufficient intermetallics to provide the module side connection with a robust second level assembly and rework process. The off-eutectic composition provides an inter-metallic phase structure in the module side fillet during assembly. The inter-metallic phase structure eliminates problems of tilt and collapse during second level assembly and aids in rework by providing a more cohesive joint allowing removal of the columns from the board without simultaneous removal from the module.

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