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公开(公告)号:EP1545826A4
公开(公告)日:2009-02-11
申请号:EP03755830
申请日:2003-09-12
Applicant: IBM
Inventor: INTERRANTE MARIO , FARCOOQ MUKTA G , SABLINSKI WILLIAM EDWARD
IPC: B23K1/00 , B23K31/02 , B23K35/12 , B23K35/14 , B23K35/26 , B23K35/34 , B23K101/40 , B23K101/42 , C22C13/00 , H05K3/34
CPC classification number: B23K1/0016 , B23K35/262 , B23K2201/36 , H01L2224/16225 , H05K3/3436 , H05K3/3463 , H05K2201/10992 , H05K2203/041 , H05K2203/0415 , Y02P70/613
Abstract: A lead free solder hierarchy for use in the second level solder connection of electronic components such as joining an electronic module (20) to a circuit board (120). An off-eutectic solder (60) concentration of SnCu or SnAg is used for the module side connection. This off-eutectic solder (60) contains sufficient intermetallics to provide the module side connection with a robust second level assembly and rework process. The off-eutectic composition (60) provides an intermetallic phase structure in the module side fillet during assembly. The intermetallic phase structure eliminates problems of tilt and collapse during second level assembly and aids in rework by providing a more cohesive joint allowing removal of the columns (100) from the board (120) without simultaneous removal from the module (20).
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公开(公告)号:WO2004026517A3
公开(公告)日:2004-05-06
申请号:PCT/US0329092
申请日:2003-09-12
Applicant: IBM
Inventor: INTERRANTE MARIO , FARCOOQ MUKTA G , SABLINSKI WILLIAM EDWARD
IPC: B23K1/00 , B23K35/14 , B23K35/26 , B23K101/40 , B23K101/42 , C22C13/00 , H05K3/34 , B23K31/02 , B23K35/12 , B23K35/34
CPC classification number: B23K1/0016 , B23K35/262 , B23K2201/36 , H01L2224/16225 , H05K3/3436 , H05K3/3463 , H05K2201/10992 , H05K2203/041 , H05K2203/0415 , Y02P70/613
Abstract: A lead free solder hierarchy for use in the second level solder connection of electronic components such as joining an electronic module (20) to a circuit board (120). An off-eutectic solder (60) concentration of SnCu or SnAg is used for the module side connection. This off-eutectic solder (60) contains sufficient intermetallics to provide the module side connection with a robust second level assembly and rework process. The off-eutectic composition (60) provides an intermetallic phase structure in the module side fillet during assembly. The intermetallic phase structure eliminates problems of tilt and collapse during second level assembly and aids in rework by providing a more cohesive joint allowing removal of the columns (100) from the board (120) without simultaneous removal from the module (20).
Abstract translation: 用于电子元件的第二层焊接连接的无铅焊料层次结构,例如将电子模块(20)连接到电路板(120)。 SnCu或SnAg的非共晶焊料(60)浓度用于模块侧连接。 这种非共晶焊料(60)含有足够的金属间化合物以提供模块侧连接,并具有稳健的二级装配和返工工艺。 非共晶组合物(60)在组装期间在模块侧边角中提供金属间相结构。 金属间相结构消除了第二级组装期间的倾斜和塌陷问题,并且通过提供更加粘性的接头允许从板(120)移除柱(100)而无需同时从模块(20)移除而帮助返工。
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公开(公告)号:AU2003273330A1
公开(公告)日:2004-04-08
申请号:AU2003273330
申请日:2003-09-12
Applicant: IBM
Inventor: FARCOOQ MUKTA G , SABLINSKI WILLIAM EDWARD , INTERRANTE MARIO
IPC: B23K1/00 , B23K35/14 , B23K35/26 , B23K101/40 , B23K101/42 , C22C13/00 , H05K3/34
Abstract: A lead free solder hierarchy for use in the second level solder connection of electronic components such as joining an electronic module to a circuit board. An off-eutectic solder concentration of SnCu or SnAg is used for the module side connection. This off-eutectic solder contains sufficient intermetallics to provide the module side connection with a robust second level assembly and rework process. The off-eutectic composition provides an inter-metallic phase structure in the module side fillet during assembly. The inter-metallic phase structure eliminates problems of tilt and collapse during second level assembly and aids in rework by providing a more cohesive joint allowing removal of the columns from the board without simultaneous removal from the module.
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公开(公告)号:AU2003273330A8
公开(公告)日:2004-04-08
申请号:AU2003273330
申请日:2003-09-12
Applicant: IBM
Inventor: FARCOOQ MUKTA G , INTERRANTE MARIO , SABLINSKI WILLIAM EDWARD
IPC: B23K1/00 , B23K35/14 , B23K35/26 , B23K101/40 , B23K101/42 , C22C13/00 , H05K3/34 , B23K31/02 , B23K35/12 , B23K35/34
Abstract: A lead free solder hierarchy for use in the second level solder connection of electronic components such as joining an electronic module to a circuit board. An off-eutectic solder concentration of SnCu or SnAg is used for the module side connection. This off-eutectic solder contains sufficient intermetallics to provide the module side connection with a robust second level assembly and rework process. The off-eutectic composition provides an inter-metallic phase structure in the module side fillet during assembly. The inter-metallic phase structure eliminates problems of tilt and collapse during second level assembly and aids in rework by providing a more cohesive joint allowing removal of the columns from the board without simultaneous removal from the module.
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