公开(公告)号：JPH1032214A

公开(公告)日：1998-02-03

申请号：JP6800897

申请日：1997-03-21

Applicant: IBM

Inventor： MICHAEL JOHN BRADY ,  CHALCO PEDRO A ,  FRANCOIS GANDON ,  PAUL ANDREW MOSKOVITZ ,  PHILIP MURPHY

IPC: H01L21/50 ,  G06K19/077 ,  H01L23/31 ,  H01L23/495 ,  H04B1/59

Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a novel, thin and flexible radio frequency(RF) tag, which is provided with a metal lead frame antenna subjected to stamping. SOLUTION: A tag is formed (150) by carrying lead frame strips having the cuttings of a lead frame antenna and a chip to a lead frame antenna mounting place. For forming the final tag product, support bars holding the lead frame antenna on the lead frame strips are cut, a package is encapsulated (500) and a treatment for cutting off encapsulated components is executed (800 to 1100) in various orders. A thin intermediate support material for lead frame use is provided by an option to add a structural support to the antenna and a sealing component is formed (1200) for the antenna.

公开(公告)号：JPH1013296A

公开(公告)日：1998-01-16

申请号：JP5482397

申请日：1997-03-10

Applicant: IBM

Inventor： MICHAEL JOHN BREDDIE ,  NORMAN JILL FAVURO ,  FRANCOIS GANDON ,  PAUL ANDREW MOSKOVITZ ,  PHILIPP MURPHY

IPC: H01Q1/40 ,  G06K19/077 ,  H01L23/29 ,  H01L23/31 ,  H01L23/495 ,  H01Q1/24 ,  H04B1/59

Abstract: PROBLEM TO BE SOLVED: To provide a thin and flexible radio transponder, using a conductive lead frame structure not only as a connecting medium but also as a transponder antenna. SOLUTION: A circuit chip 210 includes its surface and side faces, e.g. 265L, 265R, 265B and 265T which have one or plural connectors, e.g. 220A and 220B that are connected to a circuit, included in the chip 210. The chip 210 also has a center part 260 on its surface, where the connectors are included. A lead frame antenna 200 uses a thin conductive piece and has at least two ends. At least one of these two ends is electrically attached to one of the connectors in the chip 210.