公开(公告)号：JPH1032214A

公开(公告)日：1998-02-03

申请号：JP6800897

申请日：1997-03-21

Applicant: IBM

Inventor： MICHAEL JOHN BRADY ,  CHALCO PEDRO A ,  FRANCOIS GANDON ,  PAUL ANDREW MOSKOVITZ ,  PHILIP MURPHY

IPC: H01L21/50 ,  G06K19/077 ,  H01L23/31 ,  H01L23/495 ,  H04B1/59

Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a novel, thin and flexible radio frequency(RF) tag, which is provided with a metal lead frame antenna subjected to stamping. SOLUTION: A tag is formed (150) by carrying lead frame strips having the cuttings of a lead frame antenna and a chip to a lead frame antenna mounting place. For forming the final tag product, support bars holding the lead frame antenna on the lead frame strips are cut, a package is encapsulated (500) and a treatment for cutting off encapsulated components is executed (800 to 1100) in various orders. A thin intermediate support material for lead frame use is provided by an option to add a structural support to the antenna and a sealing component is formed (1200) for the antenna.