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公开(公告)号:EP0806727A3
公开(公告)日:1998-05-20
申请号:EP97302760
申请日:1997-04-22
Applicant: IBM
Inventor: ALT PAUL MATTHEW , CHALCO PEDRO A , FURMAN BRUCE KENNETH , HORTON RAYMOND ROBERT , NARAYAN CHANDRASEKHAR , OWENS BENAL LEE JR , WARREN KEVIN WILSON , WRIGHT STEVEN LORENZ
IPC: G02F1/1343 , G02F1/13 , G02F1/1362 , G06F11/20 , G09F9/30 , G09G3/20 , G09G3/36 , G11C29/00
CPC classification number: G02F1/1309 , G02F2001/136272 , G09G3/3611 , G09G3/3685 , G09G2300/0426 , G09G2310/0297 , G09G2330/08 , G11C29/76 , Y10S345/904
Abstract: A matrix addressed display system designed so as to enable data line (22) repair by electronic mechanisms which is efficient and low in cost and thus increases yield. Such active data line (22) repair utilizes additional data driver (36) outputs, a defect map memory (48) in the TFT/LCD module and modification of the data stream to the data drivers (36) by additional circuits (42) between the display and the display adapter. A bus configuration on the display substrate is utilized which combines repair flexibility, low parasitic capacitance, and the ability to easily make the necessary interconnections. The number of interconnections is kept to a minimum, the connections are reliable, and the connections may be made with conventional wire bond or laser bond technology, or disk bond technology.
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公开(公告)号:JPH1039790A
公开(公告)日:1998-02-13
申请号:JP9898197
申请日:1997-04-16
Applicant: IBM
Inventor: ALT PAUL MATTHEW , CHALCO PEDRO A , FURMAN BRUCE KENNETH , HORTON RAYMOND ROBERT , NARAYAN CHANDRASEKHAR , OWENS BENAL LEE JR , WARREN KEVIN WILSON , WRIGHT STEVEN LORENZ
IPC: G02F1/1343 , G02F1/13 , G02F1/1362 , G06F11/20 , G09F9/30 , G09G3/20 , G09G3/36 , G11C29/00
Abstract: PROBLEM TO BE SOLVED: To make possible easily and inexpensively repairing an omission in a data line by selectively activating a selected non-committed data driver and providing a data signal on a conductive line. SOLUTION: In an array 32, the number of output lines of respective data drivers 36 are increased for adding an auxiliary driver to a glass panel 34. An electric connector used for connecting an LCD panel to a data source of a host computer, etc., requires a PROM chip selecting excess line only by a piece, and other PROM signals are multiplexed by existing lines. After reset, a controller 42 decides when the input data are lapped in a temporary memory from an address in a defective map for using on an auxiliary line 38. The data supplied to a display are corrected related to defective line information stored in the memory, and the selected non-committed data driver 36 is a ctivated selectively, and the data signal is provided on the conductive line.
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公开(公告)号:JPH1032214A
公开(公告)日:1998-02-03
申请号:JP6800897
申请日:1997-03-21
Applicant: IBM
Inventor: MICHAEL JOHN BRADY , CHALCO PEDRO A , FRANCOIS GANDON , PAUL ANDREW MOSKOVITZ , PHILIP MURPHY
IPC: H01L21/50 , G06K19/077 , H01L23/31 , H01L23/495 , H04B1/59
Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a novel, thin and flexible radio frequency(RF) tag, which is provided with a metal lead frame antenna subjected to stamping. SOLUTION: A tag is formed (150) by carrying lead frame strips having the cuttings of a lead frame antenna and a chip to a lead frame antenna mounting place. For forming the final tag product, support bars holding the lead frame antenna on the lead frame strips are cut, a package is encapsulated (500) and a treatment for cutting off encapsulated components is executed (800 to 1100) in various orders. A thin intermediate support material for lead frame use is provided by an option to add a structural support to the antenna and a sealing component is formed (1200) for the antenna.
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公开(公告)号:SG52936A1
公开(公告)日:1998-09-28
申请号:SG1997000884
申请日:1997-03-21
Applicant: IBM
Inventor: ALT PAUL MATTHEW , CHALCO PEDRO A , FURMAN BRUCE KENNETH , HORTON RAYMOND ROBERT , NARAYAN CHANDRASEKHAR , OWENS BENAL LEE JR , WARREN KEVIN WILSON , WRIGHT STEVEN LORENZ
IPC: G02F1/1343 , G02F1/13 , G02F1/1362 , G06F11/20 , G09F9/30 , G09G3/20 , G09G3/36 , G11C29/00 , G09G3/16
Abstract: A matrix addressed display system designed so as to enable data line (22) repair by electronic mechanisms which is efficient and low in cost and thus increases yield. Such active data line (22) repair utilizes additional data driver (36) outputs, a defect map memory (48) in the TFT/LCD module and modification of the data stream to the data drivers (36) by additional circuits (42) between the display and the display adapter. A bus configuration on the display substrate is utilized which combines repair flexibility, low parasitic capacitance, and the ability to easily make the necessary interconnections. The number of interconnections is kept to a minimum, the connections are reliable, and the connections may be made with conventional wire bond or laser bond technology, or disk bond technology.
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公开(公告)号:HK1010264A1
公开(公告)日:1999-06-17
申请号:HK98111057
申请日:1998-09-29
Applicant: IBM
Inventor: ALT PAUL MATTHEW , CHALCO PEDRO A , FURMAN BRUCE KENNETH , HORTON RAYMOND ROBERT , NARAYAN CHANDRASEKHAR , OWENS BENAL LEE , WARREN KEVIN WILSON , WRIGHT STEVEN LORENZ
IPC: G02F1/1343 , G02F1/13 , G02F1/1362 , G06F11/20 , G09F9/30 , G09G3/20 , G09G3/36 , G11C29/00 , G09F
Abstract: A matrix addressed display system designed so as to enable data line (22) repair by electronic mechanisms which is efficient and low in cost and thus increases yield. Such active data line (22) repair utilizes additional data driver (36) outputs, a defect map memory (48) in the TFT/LCD module and modification of the data stream to the data drivers (36) by additional circuits (42) between the display and the display adapter. A bus configuration on the display substrate is utilized which combines repair flexibility, low parasitic capacitance, and the ability to easily make the necessary interconnections. The number of interconnections is kept to a minimum, the connections are reliable, and the connections may be made with conventional wire bond or laser bond technology, or disk bond technology.
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公开(公告)号:DE69714644T2
公开(公告)日:2003-05-28
申请号:DE69714644
申请日:1997-04-22
Applicant: IBM
Inventor: ALT PAUL MATTHEW , CHALCO PEDRO A , FURMAN BRUCE KENNETH , HORTON RAYMOND ROBERT , NARAYAN CHANDRASEKHAR , OWENS JR , WARREN KEVIN WILSON , WRIGHT STEVEN LORENZ
IPC: G02F1/1343 , G02F1/13 , G02F1/1362 , G06F11/20 , G09F9/30 , G09G3/20 , G09G3/36 , G11C29/00
Abstract: A matrix addressed display system designed so as to enable data line (22) repair by electronic mechanisms which is efficient and low in cost and thus increases yield. Such active data line (22) repair utilizes additional data driver (36) outputs, a defect map memory (48) in the TFT/LCD module and modification of the data stream to the data drivers (36) by additional circuits (42) between the display and the display adapter. A bus configuration on the display substrate is utilized which combines repair flexibility, low parasitic capacitance, and the ability to easily make the necessary interconnections. The number of interconnections is kept to a minimum, the connections are reliable, and the connections may be made with conventional wire bond or laser bond technology, or disk bond technology.
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公开(公告)号:DE69714644D1
公开(公告)日:2002-09-19
申请号:DE69714644
申请日:1997-04-22
Applicant: IBM
Inventor: ALT PAUL MATTHEW , CHALCO PEDRO A , FURMAN BRUCE KENNETH , HORTON RAYMOND ROBERT , NARAYAN CHANDRASEKHAR , OWENS JR , WARREN KEVIN WILSON , WRIGHT STEVEN LORENZ
IPC: G02F1/1343 , G02F1/13 , G02F1/1362 , G06F11/20 , G09F9/30 , G09G3/20 , G09G3/36 , G11C29/00
Abstract: A matrix addressed display system designed so as to enable data line (22) repair by electronic mechanisms which is efficient and low in cost and thus increases yield. Such active data line (22) repair utilizes additional data driver (36) outputs, a defect map memory (48) in the TFT/LCD module and modification of the data stream to the data drivers (36) by additional circuits (42) between the display and the display adapter. A bus configuration on the display substrate is utilized which combines repair flexibility, low parasitic capacitance, and the ability to easily make the necessary interconnections. The number of interconnections is kept to a minimum, the connections are reliable, and the connections may be made with conventional wire bond or laser bond technology, or disk bond technology.
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