公开(公告)号：DE2460988A1

公开(公告)日：1975-09-11

申请号：DE2460988

申请日：1974-12-21

Applicant: IBM

Inventor： FENG BAI-CWO ,  FLACHBART RICHARD HENRY ,  FRIED LEONARD JOEL ,  LEVINE HAROLD A ,  POUGHKEEPSIE N Y

IPC: G03F7/039 ,  G03F7/095 ,  G03F7/26 ,  G03F7/30 ,  H01L21/00 ,  H01L21/027 ,  H01L21/30 ,  H01L21/306 ,  H01L23/29 ,  H05K3/02 ,  H05K3/04 ,  H05K3/06 ,  C23C3/02

Abstract: A method for use in forming thin film patterns in the fabrication of integrated circuits. The method involves depositing a bottom layer of positive photoresist material on a substrate, and forming over the bottom layer, a discrete light-transparent top layer of positive photoresist material which is less solubilized in developer after exposure to light than is the material in the bottom layer. The top and bottom layers are preferably separated by an intermediate layer of a light-transparent polymeric material which is immiscible in the bottom layer and unaffected by the subsequently applied top layer.