公开(公告)号：EP0814511A3

公开(公告)日：1998-11-18

申请号：EP97304020

申请日：1997-06-10

Applicant: IBM

Inventor： GARBELLI FRANCESCO ,  OGGIONI STEFANO

IPC: H01L23/12 ,  H01L21/60 ,  H01L23/31 ,  H01L23/498 ,  H05K1/11 ,  H05K3/34 ,  H01L23/13

CPC classification number: H01L23/49816 ,  H01L23/3128 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3511 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/094 ,  H05K2201/10734 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A Plastic Ball Grid Array electronic package having the conductive metal pads of variable area. The central pads are wider than those closer to the border for compensating the warpage effect on the final package.

公开(公告)号：EP0814511A2

公开(公告)日：1997-12-29

申请号：EP97304020

申请日：1997-06-10

Applicant: IBM

Inventor： GARBELLI FRANCESCO ,  OGGIONI STEFANO

IPC: H01L23/12 ,  H01L21/60 ,  H01L23/31 ,  H01L23/498 ,  H05K1/11 ,  H05K3/34 ,  H01L23/13

CPC classification number: H01L23/49816 ,  H01L23/3128 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3511 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/094 ,  H05K2201/10734 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A Plastic Ball Grid Array electronic package having the conductive metal pads of variable area. The central pads are wider than those closer to the border for compensating the warpage effect on the final package.

Abstract translation: 塑料球栅阵列电子封装，具有可变面积的导电金属焊盘。 中心垫比靠近边框的中心垫更宽，以补偿最终包装的翘曲效果。

公开(公告)号：MY117869A

公开(公告)日：2004-08-30

申请号：MYPI9705190

申请日：1997-11-03

Applicant: IBM

Inventor： GARBELLI FRANCESCO ,  MONTI ALBERTO ,  OGGIONI STEFANO

IPC: H01L21/68 ,  H01L23/13 ,  H01L23/31 ,  H05K1/14 ,  H05K3/30 ,  H05K7/12

Abstract: IN THE MANUFACTURING PROCESS OF ELECTRONIC MODULES A PROBLEM COULD ARISE WHEN THE MODULES HAVE NON-FLAT TOP SURFACE. THIS IS DUE TO THE FACT THAT MOST OF THE AUTOMATIC PICKING TOOLS USES A VACUUM NOZZLE TO PICK AND PLACE THE MODULE. ACCORDING TO THE PRESENT INVENTION A FLAT FEATURE(301) (A CAP OR A STUD) IS ADDED TO THE MODULE(101). THIS FLAT FEATURE CAN BE EITHER FIXED ON THE MODULE OR REMOVABLE AFTER THE MANUFACTURE IN ORDER TO REDUCE THE DIMENSIONS. (FIG.3)

公开(公告)号：CA2222602C

公开(公告)日：2003-06-24

申请号：CA2222602

申请日：1997-11-27

Applicant: IBM

Inventor： OGGIONI STEFANO ,  GARBELLI FRANCESCO ,  MONTI ALBERTO

IPC: H01L21/68 ,  H01L23/31 ,  H05K1/14 ,  H05K3/30 ,  H05K13/04

Abstract: In the manufacturing process of electronic modules a problem could arise whe n the modules have non-flat top surface. This is due to the fact that most of the automati c picking tools uses a vacuum nozzle to pick and place the module. According to the present inventi on a flat feature (a cap or a stud) is added to the module. This flat feature can be either fixed on the module or removable after the manufacture in order to reduce the dimensions.

公开(公告)号：CA2222602A1

公开(公告)日：1998-06-04

申请号：CA2222602

申请日：1997-11-27

Applicant: IBM

Inventor： OGGIONI STEFANO ,  GARBELLI FRANCESCO ,  MONTI ALBERTO

IPC: H01L21/68 ,  H01L23/31 ,  H05K1/14 ,  H05K3/30 ,  H05K13/04

Abstract: In the manufacturing process of electronic modules a problem could arise whe n the modules have non-flat top surface. This is due to the fact that most of the automati c picking tools uses a vacuum nozzle to pick and place the module. According to the present inventi on a flat feature (a cap or a stud) is added to the module. This flat feature can be either fixed on the module or removable after the manufacture in order to reduce the dimensions.

公开(公告)号：SG55406A1

公开(公告)日：1998-12-21

申请号：SG1997003942

申请日：1997-11-03

Applicant: IBM

Inventor： GARBELLI FRANCESCO ,  MONTI ALBERTO ,  OGGIONI STEFANO

IPC: H01L21/68 ,  H01L23/31 ,  H05K1/14 ,  H05K3/30

Abstract: In the manufacturing process of electronic modules a problem could arise when the modules have non-flat top surface. This is due to the fact that most of the automatic picking tools uses a vacuum nozzle to pick and place the module. According to the present invention a flat feature (a cap or a stud) is added to the module. This flat feature can be either fixed on the module or removable after the manufacture in order to reduce the dimensions.

公开(公告)号：GB2320132A

公开(公告)日：1998-06-10

申请号：GB9625233

申请日：1996-12-04

Applicant: IBM

Inventor： GARBELLI FRANCESCO ,  MONTI ALBERTO ,  OGGIONI STEFANO

IPC: H01L21/68 ,  H01L23/31 ,  H05K1/14 ,  H05K3/30 ,  H01L21/00 ,  H05K13/04

Abstract: In the manufacturing process of electronic modules a problem could arise when the modules have non-flat top surface. This is due to the fact that most of the automatic picking tools use a vacuum nozzle to pick and place the module. According to the present invention a flat feature 301 (e.g. a cap or a stud) is added to the module 101. This flat feature can be either fixed on the module or removable after the manufacture in order to reduce the dimensions.

公开(公告)号：GB2314463A

公开(公告)日：1997-12-24

申请号：GB9612769

申请日：1996-06-19

Applicant: IBM

Inventor： GARBELLI FRANCESCO ,  OGGIONI STEFANO

IPC: H01L23/12 ,  H01L21/60 ,  H01L23/31 ,  H01L23/498 ,  H05K1/11 ,  H05K3/34

Abstract: A Plastic Ball Grid Array electronic package having the conductive metal pads of variable area. The central pads are wider than those closer to the border for compensating the warpage effect on the final package.