公开(公告)号：SG55406A1

公开(公告)日：1998-12-21

申请号：SG1997003942

申请日：1997-11-03

Applicant: IBM

Inventor： GARBELLI FRANCESCO ,  MONTI ALBERTO ,  OGGIONI STEFANO

IPC: H01L21/68 ,  H01L23/31 ,  H05K1/14 ,  H05K3/30

Abstract: In the manufacturing process of electronic modules a problem could arise when the modules have non-flat top surface. This is due to the fact that most of the automatic picking tools uses a vacuum nozzle to pick and place the module. According to the present invention a flat feature (a cap or a stud) is added to the module. This flat feature can be either fixed on the module or removable after the manufacture in order to reduce the dimensions.

公开(公告)号：GB2320132A

公开(公告)日：1998-06-10

申请号：GB9625233

申请日：1996-12-04

Applicant: IBM

Inventor： GARBELLI FRANCESCO ,  MONTI ALBERTO ,  OGGIONI STEFANO

IPC: H01L21/68 ,  H01L23/31 ,  H05K1/14 ,  H05K3/30 ,  H01L21/00 ,  H05K13/04

Abstract: In the manufacturing process of electronic modules a problem could arise when the modules have non-flat top surface. This is due to the fact that most of the automatic picking tools use a vacuum nozzle to pick and place the module. According to the present invention a flat feature 301 (e.g. a cap or a stud) is added to the module 101. This flat feature can be either fixed on the module or removable after the manufacture in order to reduce the dimensions.

公开(公告)号：MY117869A

公开(公告)日：2004-08-30

申请号：MYPI9705190

申请日：1997-11-03

Applicant: IBM

Inventor： GARBELLI FRANCESCO ,  MONTI ALBERTO ,  OGGIONI STEFANO

IPC: H01L21/68 ,  H01L23/13 ,  H01L23/31 ,  H05K1/14 ,  H05K3/30 ,  H05K7/12

Abstract: IN THE MANUFACTURING PROCESS OF ELECTRONIC MODULES A PROBLEM COULD ARISE WHEN THE MODULES HAVE NON-FLAT TOP SURFACE. THIS IS DUE TO THE FACT THAT MOST OF THE AUTOMATIC PICKING TOOLS USES A VACUUM NOZZLE TO PICK AND PLACE THE MODULE. ACCORDING TO THE PRESENT INVENTION A FLAT FEATURE(301) (A CAP OR A STUD) IS ADDED TO THE MODULE(101). THIS FLAT FEATURE CAN BE EITHER FIXED ON THE MODULE OR REMOVABLE AFTER THE MANUFACTURE IN ORDER TO REDUCE THE DIMENSIONS. (FIG.3)

公开(公告)号：CA2222602C

公开(公告)日：2003-06-24

申请号：CA2222602

申请日：1997-11-27

Applicant: IBM

Inventor： OGGIONI STEFANO ,  GARBELLI FRANCESCO ,  MONTI ALBERTO

IPC: H01L21/68 ,  H01L23/31 ,  H05K1/14 ,  H05K3/30 ,  H05K13/04

Abstract: In the manufacturing process of electronic modules a problem could arise whe n the modules have non-flat top surface. This is due to the fact that most of the automati c picking tools uses a vacuum nozzle to pick and place the module. According to the present inventi on a flat feature (a cap or a stud) is added to the module. This flat feature can be either fixed on the module or removable after the manufacture in order to reduce the dimensions.

公开(公告)号：CA2222602A1

公开(公告)日：1998-06-04

申请号：CA2222602

申请日：1997-11-27

Applicant: IBM

Inventor： OGGIONI STEFANO ,  GARBELLI FRANCESCO ,  MONTI ALBERTO

IPC: H01L21/68 ,  H01L23/31 ,  H05K1/14 ,  H05K3/30 ,  H05K13/04

Abstract: In the manufacturing process of electronic modules a problem could arise whe n the modules have non-flat top surface. This is due to the fact that most of the automati c picking tools uses a vacuum nozzle to pick and place the module. According to the present inventi on a flat feature (a cap or a stud) is added to the module. This flat feature can be either fixed on the module or removable after the manufacture in order to reduce the dimensions.