公开(公告)号：DE69522993T2

公开(公告)日：2002-05-16

申请号：DE69522993

申请日：1995-02-20

Applicant: IBM

Inventor： ARLDT ROY LYNN ,  DOWNEY SUSAN HANZELKA ,  GOLDEN HARRY JAMES ,  OKORO CLEMENT ADINDU ,  SPALIK JAMES

IPC: B23K35/36 ,  C07C55/16 ,  B23K35/363 ,  H05K3/34

Abstract: A new flux composition, as well as corresponding methods for soldering electronic components to printed circuit boards, is disclosed. The new flux composition includes pimelic acid and two organic solvents. Significantly, the new flux composition leaves essentially no ionic residues at the completion of the soldering processes used to mount electronic components onto printed circuit boards.

公开(公告)号：DE69522993D1

公开(公告)日：2001-11-08

申请号：DE69522993

申请日：1995-02-20

Applicant: IBM

Inventor： ARLDT ROY LYNN ,  DOWNEY SUSAN HANZELKA ,  GOLDEN HARRY JAMES ,  OKORO CLEMENT ADINDU ,  SPALIK JAMES

IPC: B23K35/36 ,  C07C55/16 ,  B23K35/363 ,  H05K3/34

Abstract: A new flux composition, as well as corresponding methods for soldering electronic components to printed circuit boards, is disclosed. The new flux composition includes pimelic acid and two organic solvents. Significantly, the new flux composition leaves essentially no ionic residues at the completion of the soldering processes used to mount electronic components onto printed circuit boards.

公开(公告)号：SG30367A1

公开(公告)日：1996-06-01

申请号：SG1995000356

申请日：1995-04-28

Applicant: IBM

Inventor： OKORO CLEMENT ADINDU ,  GOLDEN HARRY JAMES ,  SPALIK JAMES ,  ARLDT ROY LYNN ,  DOWNEY SUSAN HANZELKA ,  MAHMOUD ISSA SAID

IPC: B23K35/36