公开(公告)号：DE69431866T2

公开(公告)日：2003-08-28

申请号：DE69431866

申请日：1994-10-28

Applicant: IBM

Inventor： ARLDT ROY LYNN ,  BOYKO CHRISTINA MARIE ,  CAYSON BURTRAN JOE ,  KOZLOWSKI RICHARD MICHAEL ,  KULESZA JOSEPH DUANE ,  LAUFFER JOHN MATTHEW ,  LIU PHILIP CHIHCHAU ,  MARKOVICH VOYA RISTA ,  MAHMOUD ISSA SAID ,  MUSKA JAMES FRANCIS ,  PAPATHOMAS KOSTAS ,  SABIA JOSEPH GENE

IPC: B32B7/04 ,  C08G59/40 ,  C08G73/00 ,  C08L63/00 ,  C09D163/00 ,  H01B1/20 ,  H01B1/22 ,  H01B1/24 ,  H05K1/09 ,  H05K1/11 ,  H05K1/16 ,  H05K3/00 ,  H05K3/40

公开(公告)号：DE69522993T2

公开(公告)日：2002-05-16

申请号：DE69522993

申请日：1995-02-20

Applicant: IBM

Inventor： ARLDT ROY LYNN ,  DOWNEY SUSAN HANZELKA ,  GOLDEN HARRY JAMES ,  OKORO CLEMENT ADINDU ,  SPALIK JAMES

IPC: B23K35/36 ,  C07C55/16 ,  B23K35/363 ,  H05K3/34

Abstract: A new flux composition, as well as corresponding methods for soldering electronic components to printed circuit boards, is disclosed. The new flux composition includes pimelic acid and two organic solvents. Significantly, the new flux composition leaves essentially no ionic residues at the completion of the soldering processes used to mount electronic components onto printed circuit boards.

公开(公告)号：DE69434192T2

公开(公告)日：2005-12-08

申请号：DE69434192

申请日：1994-10-28

Applicant: IBM

Inventor： ARLDT ROY LYNN ,  BOYKO CHRISTINA MARIE ,  CAYSON BURTAN JOE ,  KOZLOWSKI RICHARD MICHAEL ,  KULESZA JOSEPH DUANE ,  LAUFFER JOHN MATTHEW ,  LIU PHILIP CHIHCHAU ,  MARKOVICH VOYA RISTA ,  MAHMOUD ISSA SAID ,  MUSKA JAMES FRANCIS ,  PAPATHOMAS KOSTAS ,  SABIA JOSEPH GENE

IPC: B32B7/04 ,  C08G59/40 ,  C08G73/00 ,  C08L63/00 ,  C09D163/00 ,  H01B1/20 ,  H01B1/22 ,  H01B1/24 ,  H05K1/09 ,  H05K1/11 ,  H05K1/16 ,  H05K3/00 ,  H05K3/40

公开(公告)号：DE69434192D1

公开(公告)日：2005-01-20

申请号：DE69434192

申请日：1994-10-28

Applicant: IBM

Inventor： ARLDT ROY LYNN ,  BOYKO CHRISTINA MARIE ,  CAYSON BURTAN JOE ,  KOZLOWSKI RICHARD MICHAEL ,  KULESZA JOSEPH DUANE ,  LAUFFER JOHN MATTHEW ,  LIU PHILIP CHIHCHAU ,  MARKOVICH VOYA RISTA ,  MAHMOUD ISSA SAID ,  MUSKA JAMES FRANCIS ,  PAPATHOMAS KOSTAS ,  SABIA JOSEPH GENE

IPC: B32B7/04 ,  C08G59/40 ,  C08G73/00 ,  C08L63/00 ,  C09D163/00 ,  H01B1/20 ,  H01B1/22 ,  H01B1/24 ,  H05K1/09 ,  H05K1/11 ,  H05K1/16 ,  H05K3/00 ,  H05K3/40

公开(公告)号：DE69522993D1

公开(公告)日：2001-11-08

申请号：DE69522993

申请日：1995-02-20

Applicant: IBM

Inventor： ARLDT ROY LYNN ,  DOWNEY SUSAN HANZELKA ,  GOLDEN HARRY JAMES ,  OKORO CLEMENT ADINDU ,  SPALIK JAMES

IPC: B23K35/36 ,  C07C55/16 ,  B23K35/363 ,  H05K3/34

Abstract: A new flux composition, as well as corresponding methods for soldering electronic components to printed circuit boards, is disclosed. The new flux composition includes pimelic acid and two organic solvents. Significantly, the new flux composition leaves essentially no ionic residues at the completion of the soldering processes used to mount electronic components onto printed circuit boards.

公开(公告)号：DE69431866D1

公开(公告)日：2003-01-23

申请号：DE69431866

申请日：1994-10-28

Applicant: IBM

Inventor： ARLDT ROY LYNN ,  BOYKO CHRISTINA MARIE ,  CAYSON BURTRAN JOE ,  KOZLOWSKI RICHARD MICHAEL ,  KULESZA JOSEPH DUANE ,  LAUFFER JOHN MATTHEW ,  LIU PHILIP CHIHCHAU ,  MARKOVICH VOYA RISTA ,  MAHMOUD ISSA SAID ,  MUSKA JAMES FRANCIS ,  PAPATHOMAS KOSTAS ,  SABIA JOSEPH GENE

IPC: B32B7/04 ,  C08G59/40 ,  C08G73/00 ,  C08L63/00 ,  C09D163/00 ,  H01B1/20 ,  H01B1/22 ,  H01B1/24 ,  H05K1/09 ,  H05K1/11 ,  H05K1/16 ,  H05K3/00 ,  H05K3/40

公开(公告)号：SG30367A1

公开(公告)日：1996-06-01

申请号：SG1995000356

申请日：1995-04-28

Applicant: IBM

Inventor： OKORO CLEMENT ADINDU ,  GOLDEN HARRY JAMES ,  SPALIK JAMES ,  ARLDT ROY LYNN ,  DOWNEY SUSAN HANZELKA ,  MAHMOUD ISSA SAID

IPC: B23K35/36