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    DIRECT ACCESS MEMORY DEVICE WITH A MAGNETORESISTIVE TRANSDUCER HEAD
    1.
    发明专利
    DIRECT ACCESS MEMORY DEVICE WITH A MAGNETORESISTIVE TRANSDUCER HEAD 未知

    公开(公告)号：PL320333A1

    公开(公告)日：1997-09-29

    申请号：PL32033395

    申请日：1995-10-21

    Applicant: IBM

    Inventor： COFFEY JEROME THOMAS ,  GOODMAN DALE ERNEST ,  POSS JOE MARTIN

    IPC: G11B21/02 ,  G11B5/00 ,  G11B5/012 ,  G11B5/02 ,  G11B5/17 ,  G11B5/39 ,  G11B5/48 ,  G11B5/60 ,  G11B23/00

    Abstract: A direct access storage device includes at least one disk mounted for rotation about an axis and having opposed disk surfaces for storing data. A magneto-resistive (MR) transducer head is mounted for movement across each respective disk surface for writing to and for reading data signals from the disk surface. Each MR transducer head includes a write element and a read element. A preamplifier, associated with the MR transducer head, amplifies read and write signals of the read element and the write element. A flex cable couples the read and write signals between the preamplifier and the MR transducer heads. The flex cable includes a common read return signal line for each sequential pair of the MR transducer heads.

    Universal surface finish for dca smt and pad on pad interconnections
    2.
    发明专利
    Universal surface finish for dca smt and pad on pad interconnections 未知

    公开(公告)号：SG71123A1

    公开(公告)日：2000-03-21

    申请号：SG1998001312

    申请日：1998-06-08

    Applicant: IBM

    Inventor： GOODMAN DALE ERNEST ,  HOFFMEYER MARK KENNETH ,  KRABBENHOFT ROGER SCOTT

    IPC: H05K3/24 ,  H05K3/34

    Abstract: A printed circuit connector terminal pad coating technique is disclosed which functions as a single universal pad surface which supports multiple electrical connection practices including wirebonding, soldering, and wear resistant, pad on pad mechanical connection. The tri-plate surface treatment includes an initial diffusion resistant coating of nickel; an intermediate layer of hard, wear resistant noble or semi-noble metal that provides pad on pad connector reliability and affords a metallurgically stable solder joints and wirebond interfaces; and a final coating of soft gold. The intermediate layer may be pure palladium having a nominal thickness of 35 microinches or a layer of gold, hardened by cobalt, nickel, iron or a combination of these dopants to effect a hardness of 200 to 250 (Knoop scale) . The use of a common surface treatment for the multiple attachment processes is implemented with a single masking step, rather than a sequence of selective masking, plating and stripping operations. In the printed circuit environment, the masking is provided by the final covering that encloses, seals, and electrically insulates the conductors in a circuit board application or in the instance of a flexcable, the adhesive coated flexible coverlay the covers and seals the copper conductor elements while exposing the conductor terminal pads.

    3.
    发明专利
    未知

    公开(公告)号：DE69834768D1

    公开(公告)日：2006-07-20

    申请号：DE69834768

    申请日：1998-04-29

    Applicant: IBM

    Inventor： GOODMAN DALE ERNEST ,  HOFFMEYER MARK KENNETH ,  KRABBENHOFT ROGER SCOTT

    IPC: H05K3/24 ,  H05K1/09

    Abstract: A printed circuit connector terminal pad coating technique is disclosed which functions as a single universal pad surface which supports multiple electrical connection practices including wirebonding, soldering, and wear resistant, pad on pad mechanical connection. The tri-plate surface treatment includes an initial diffusion resistant coating of nickel; an intermediate layer of hard, wear resistant noble or semi-noble metal that provides pad on pad connector reliability and affords a metallurgically stable solder joints and wirebond interfaces; and a final coating of soft gold. The intermediate layer may be pure palladium having a nominal thickness of 35 microinches or a layer of gold, hardened by cobalt, nickel, iron or a combination of these dopants to effect a hardness of 200 to 250 (Knoop scale) . The use of a common surface treatment for the multiple attachment processes is implemented with a single masking step, rather than a sequence of selective masking, plating and stripping operations. In the printed circuit environment, the masking is provided by the final covering that encloses, seals, and electrically insulates the conductors in a circuit board application or in the instance of a flexcable, the adhesive coated flexible coverlay the covers and seals the copper conductor elements while exposing the conductor terminal pads.

    Direct access storage device including mechanism of magneto-resistive transducer head
    5.
    发明专利
    Direct access storage device including mechanism of magneto-resistive transducer head 未知

    公开(公告)号：CZ287651B6

    公开(公告)日：2001-01-17

    申请号：CZ140197

    申请日：1995-10-21

    Applicant: IBM

    Inventor： COFFEY J ROME THOMAS ,  GOODMAN DALE ERNEST ,  POSS JOE MARTIN

    IPC: G11B5/48

    Abstract: The device includes disks mounted for rotation about an axis and having opposed disk surfaces for storing data. A magneto-resistive transducer head is mounted for movement across each respective disk surface for writing to and for reading data signals from the disk surface. Each magneto-resistive transducer head includes a write element and a read element. A preamplifier associated with the magneto-resistive transducer head, amplifies read and write signals of the read element and the write element. A flexible cable couples the read and write signals between the preamplifier and the magneto-resistive transducer heads. The flexible cable includes a common read return signal line for each sequential pair of the magneto-resistive transducer heads.

    7.
    发明专利
    未知

    公开(公告)号：DE69834768T2

    公开(公告)日：2007-05-24

    申请号：DE69834768

    申请日：1998-04-29

    Applicant: IBM

    Inventor： GOODMAN DALE ERNEST ,  HOFFMEYER MARK KENNETH ,  KRABBENHOFT ROGER SCOTT

    IPC: H05K3/24 ,  H05K1/09

    Abstract: A printed circuit connector terminal pad coating technique is disclosed which functions as a single universal pad surface which supports multiple electrical connection practices including wirebonding, soldering, and wear resistant, pad on pad mechanical connection. The tri-plate surface treatment includes an initial diffusion resistant coating of nickel; an intermediate layer of hard, wear resistant noble or semi-noble metal that provides pad on pad connector reliability and affords a metallurgically stable solder joints and wirebond interfaces; and a final coating of soft gold. The intermediate layer may be pure palladium having a nominal thickness of 35 microinches or a layer of gold, hardened by cobalt, nickel, iron or a combination of these dopants to effect a hardness of 200 to 250 (Knoop scale) . The use of a common surface treatment for the multiple attachment processes is implemented with a single masking step, rather than a sequence of selective masking, plating and stripping operations. In the printed circuit environment, the masking is provided by the final covering that encloses, seals, and electrically insulates the conductors in a circuit board application or in the instance of a flexcable, the adhesive coated flexible coverlay the covers and seals the copper conductor elements while exposing the conductor terminal pads.

    UNIVERSAL SURFACE FINISH FOR DCA, SMT AND PAD ON PAD INTERCONNECTIONS.
    8.
    发明专利
    UNIVERSAL SURFACE FINISH FOR DCA, SMT AND PAD ON PAD INTERCONNECTIONS. 未知

    公开(公告)号：MY115395A

    公开(公告)日：2003-05-31

    申请号：MYPI9802088

    申请日：1998-05-08

    Applicant: IBM

    Inventor： GOODMAN DALE ERNEST ,  HOFFMEYER MARK KENNETH ,  KRABBENHOFT ROGER SCOTT

    IPC: H05K1/16 ,  H05K3/24

    Abstract: A PRINTED CIRCUIT CONNECTOR TERMINAL PAD COATING TECHNIQUE IS DISLCOSED WHICH FUNCTIONS AS A SINGLE UNIVERSAL PAD SURFACE WHICH SUPPORTS MULTIPLE ELECTRICAL CONNECTION PRACTICES INCLUDING WIREBONDING, SOLDERING, AND WEAR RESISTANT, PAD ON PAD MECHANICAL CONNECTION. THE TRI-PLATE SURFACE TREATMENT INCLUDES AN INITIAL DIFFUSION RESISTANT COATING (37) OF NICKEL; AN INTERMEDIATE LAYER (39) OF HARD, WEAR RESISTANT NOBLE OR SEMI-NOBLE METAL THAT PROVIDES PAD ON PAD CONNECTOR RELIABILITY AND AFFORDS A METALLURGICALLY STABLE SOLDER JOINTS AND WIREBOND INTERFACES; AND A FINAL COATING (41) OF SOFT GOLD. THE INTERMEDIATE LAYER (39) MAY BE PURE PALLADIUM HAVING A NOMINAL THICKNESS OF (35 MICROINCHES) OR A LAYER OF GOLD, HARDENED BY COBALT, NICKEL, IRON OR A COMBINATION OF THESE DOPANTS TO EFFECT A HARDNESS OF 200 TO 250 (KNOOP SCALE). THE USE OF A COMMON SURFACE TREATMENT FOR THE MULTIPLE ATTACHMENT PRICESSES IS IMPLEMENTED WITH A SINGLE MASKING STEP, RATHER THAN A SEQUENCE OF SELECTIVE MASKING, PLATING AND STRIPPING OPERATIONS. IN THE PRINTER CIRCUIT ENVIRONMENT, THE MASKING IS PROVIDED BY THE FINAL COVERING THAT ENCLOSES, SEALS, AND ELECTRICALLY INSULATES THE CONDUCTORS IN A CIRCUIT BOARD APPLICATION OR IN THE INSTANCE OF A FLEXCABLE, THE ADHESIVE COATED FLEXIBLE COVERLAY (34) THE COVERS AND SEALS THE COPPER CONDUCTOR ELEMENTS WHILE EXPOSING THE CONDUCTOR TERMINAL PADS (33).

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