公开(公告)号：DE112016003031T5

公开(公告)日：2018-03-22

申请号：DE112016003031

申请日：2016-09-13

Applicant: IBM

Inventor： BRODSKY WILLIAM LOUIS ,  PEETS MICHAEL ,  LONG DAVID CLIFFORD ,  KRABBENHOFT ROGER SCOTT ,  DRAGONE SILVIO ,  OGGIONI STEFANO SERGIO ,  SANTIAGO-FERNANDEZ WILLIAM

IPC: H05K5/02

Abstract: Elektronische Schaltungen, Elektronikbausteine und Fertigungsverfahren werden bereitgestellt. Die elektronische Schaltung beinhaltet eine mehrschichtige Leiterplatte und einen auf Manipulation ansprechenden Sensor, der in die Leiterplatte integriert ist. Der auf Manipulation ansprechende Sensor definiert zumindest zum Teil einen sicheren Raum, der der mehrschichtigen Leiterplatte zugehörig ist. Bei bestimmten Implementierungen beinhaltet der auf Manipulation ansprechende Sensor mehrere auf Manipulation ansprechende Schichten, die in die Leiterplatte integriert sind, die zum Beispiel einen oder mehrere auf Manipulation ansprechende Rahmen und eine oder mehrere auf Manipulation ansprechende Unterlagenschichten beinhalten, wobei der/die auf Manipulation ansprechende(n) Rahmen zumindest zum Teil oberhalb der auf Manipulation ansprechenden Unterlagenschicht(en) angeordnet ist/sind, die gemeinsam den sicheren Raum definieren, wo er sich in die mehrschichtige Leiterplatte erstreckt. Bei bestimmten Ausführungsformen ist eine oder sind mehrere der auf Manipulation ansprechenden Schichten in mehrere getrennte auf Manipulation ansprechende Schaltungsbereiche unterteilt, wobei die auf Manipulation ansprechenden Schichten, die die Schaltungsbereiche beinhalten, mit Überwachungsschaltungen innerhalb des sicheren Raums elektrisch verbunden sind.

公开(公告)号：DE69834768D1

公开(公告)日：2006-07-20

申请号：DE69834768

申请日：1998-04-29

Applicant: IBM

Inventor： GOODMAN DALE ERNEST ,  HOFFMEYER MARK KENNETH ,  KRABBENHOFT ROGER SCOTT

IPC: H05K3/24 ,  H05K1/09

Abstract: A printed circuit connector terminal pad coating technique is disclosed which functions as a single universal pad surface which supports multiple electrical connection practices including wirebonding, soldering, and wear resistant, pad on pad mechanical connection. The tri-plate surface treatment includes an initial diffusion resistant coating of nickel; an intermediate layer of hard, wear resistant noble or semi-noble metal that provides pad on pad connector reliability and affords a metallurgically stable solder joints and wirebond interfaces; and a final coating of soft gold. The intermediate layer may be pure palladium having a nominal thickness of 35 microinches or a layer of gold, hardened by cobalt, nickel, iron or a combination of these dopants to effect a hardness of 200 to 250 (Knoop scale) . The use of a common surface treatment for the multiple attachment processes is implemented with a single masking step, rather than a sequence of selective masking, plating and stripping operations. In the printed circuit environment, the masking is provided by the final covering that encloses, seals, and electrically insulates the conductors in a circuit board application or in the instance of a flexcable, the adhesive coated flexible coverlay the covers and seals the copper conductor elements while exposing the conductor terminal pads.

公开(公告)号：SG71123A1

公开(公告)日：2000-03-21

申请号：SG1998001312

申请日：1998-06-08

Applicant: IBM

Inventor： GOODMAN DALE ERNEST ,  HOFFMEYER MARK KENNETH ,  KRABBENHOFT ROGER SCOTT

IPC: H05K3/24 ,  H05K3/34

Abstract: A printed circuit connector terminal pad coating technique is disclosed which functions as a single universal pad surface which supports multiple electrical connection practices including wirebonding, soldering, and wear resistant, pad on pad mechanical connection. The tri-plate surface treatment includes an initial diffusion resistant coating of nickel; an intermediate layer of hard, wear resistant noble or semi-noble metal that provides pad on pad connector reliability and affords a metallurgically stable solder joints and wirebond interfaces; and a final coating of soft gold. The intermediate layer may be pure palladium having a nominal thickness of 35 microinches or a layer of gold, hardened by cobalt, nickel, iron or a combination of these dopants to effect a hardness of 200 to 250 (Knoop scale) . The use of a common surface treatment for the multiple attachment processes is implemented with a single masking step, rather than a sequence of selective masking, plating and stripping operations. In the printed circuit environment, the masking is provided by the final covering that encloses, seals, and electrically insulates the conductors in a circuit board application or in the instance of a flexcable, the adhesive coated flexible coverlay the covers and seals the copper conductor elements while exposing the conductor terminal pads.

公开(公告)号：DE69834768T2

公开(公告)日：2007-05-24

申请号：DE69834768

申请日：1998-04-29

Applicant: IBM

Inventor： GOODMAN DALE ERNEST ,  HOFFMEYER MARK KENNETH ,  KRABBENHOFT ROGER SCOTT

IPC: H05K3/24 ,  H05K1/09

Abstract: A printed circuit connector terminal pad coating technique is disclosed which functions as a single universal pad surface which supports multiple electrical connection practices including wirebonding, soldering, and wear resistant, pad on pad mechanical connection. The tri-plate surface treatment includes an initial diffusion resistant coating of nickel; an intermediate layer of hard, wear resistant noble or semi-noble metal that provides pad on pad connector reliability and affords a metallurgically stable solder joints and wirebond interfaces; and a final coating of soft gold. The intermediate layer may be pure palladium having a nominal thickness of 35 microinches or a layer of gold, hardened by cobalt, nickel, iron or a combination of these dopants to effect a hardness of 200 to 250 (Knoop scale) . The use of a common surface treatment for the multiple attachment processes is implemented with a single masking step, rather than a sequence of selective masking, plating and stripping operations. In the printed circuit environment, the masking is provided by the final covering that encloses, seals, and electrically insulates the conductors in a circuit board application or in the instance of a flexcable, the adhesive coated flexible coverlay the covers and seals the copper conductor elements while exposing the conductor terminal pads.

公开(公告)号：MY115395A

公开(公告)日：2003-05-31

申请号：MYPI9802088

申请日：1998-05-08

Applicant: IBM

Inventor： GOODMAN DALE ERNEST ,  HOFFMEYER MARK KENNETH ,  KRABBENHOFT ROGER SCOTT

IPC: H05K1/16 ,  H05K3/24

Abstract: A PRINTED CIRCUIT CONNECTOR TERMINAL PAD COATING TECHNIQUE IS DISLCOSED WHICH FUNCTIONS AS A SINGLE UNIVERSAL PAD SURFACE WHICH SUPPORTS MULTIPLE ELECTRICAL CONNECTION PRACTICES INCLUDING WIREBONDING, SOLDERING, AND WEAR RESISTANT, PAD ON PAD MECHANICAL CONNECTION. THE TRI-PLATE SURFACE TREATMENT INCLUDES AN INITIAL DIFFUSION RESISTANT COATING (37) OF NICKEL; AN INTERMEDIATE LAYER (39) OF HARD, WEAR RESISTANT NOBLE OR SEMI-NOBLE METAL THAT PROVIDES PAD ON PAD CONNECTOR RELIABILITY AND AFFORDS A METALLURGICALLY STABLE SOLDER JOINTS AND WIREBOND INTERFACES; AND A FINAL COATING (41) OF SOFT GOLD. THE INTERMEDIATE LAYER (39) MAY BE PURE PALLADIUM HAVING A NOMINAL THICKNESS OF (35 MICROINCHES) OR A LAYER OF GOLD, HARDENED BY COBALT, NICKEL, IRON OR A COMBINATION OF THESE DOPANTS TO EFFECT A HARDNESS OF 200 TO 250 (KNOOP SCALE). THE USE OF A COMMON SURFACE TREATMENT FOR THE MULTIPLE ATTACHMENT PRICESSES IS IMPLEMENTED WITH A SINGLE MASKING STEP, RATHER THAN A SEQUENCE OF SELECTIVE MASKING, PLATING AND STRIPPING OPERATIONS. IN THE PRINTER CIRCUIT ENVIRONMENT, THE MASKING IS PROVIDED BY THE FINAL COVERING THAT ENCLOSES, SEALS, AND ELECTRICALLY INSULATES THE CONDUCTORS IN A CIRCUIT BOARD APPLICATION OR IN THE INSTANCE OF A FLEXCABLE, THE ADHESIVE COATED FLEXIBLE COVERLAY (34) THE COVERS AND SEALS THE COPPER CONDUCTOR ELEMENTS WHILE EXPOSING THE CONDUCTOR TERMINAL PADS (33).