公开(公告)号：AU2021215331A1

公开(公告)日：2022-07-07

申请号：AU2021215331

申请日：2021-02-03

Applicant: IBM

Inventor： AFZALI-ARDAKANI ALI ,  HAIGHT RICHARD ,  SANDBERG MARTIN ,  ADIGA VIVEKANANDA

IPC: H01L39/24 ,  B82Y10/00 ,  G06N10/00 ,  H01L27/18

Abstract: Devices, methods, and/or computer-implemented methods that can facilitate formation of a self assembled monolayer on a quantum device are provided. According to an embodiment, a device can comprise a qubit formed on a substrate. The device can further comprise a self assembled monolayer formed on the qubit.

公开(公告)号：AU2020381947A1

公开(公告)日：2022-04-28

申请号：AU2020381947

申请日：2020-11-10

Applicant: IBM

Inventor： HAIGHT RICHARD ,  AFZALI-ARDAKANI ALI ,  ADIGA VIVEKANANDA ,  SANDBERG MARTIN ,  PAIK HANHEE

IPC: H01L27/18 ,  H01L39/24

Abstract: Techniques regarding encapsulating one or more superconducting devices of a quantum processor (100) are provided. For example, one or more embodiments described herein can regard a method that can comprise depositing an adhesion layer (402) onto a superconducting resonator (102) and a silicon substrate (104) that are comprised within a quantum processor. The superconducting resonator can be positioned on the silicon substrate. Also, the adhesion layer can comprise a chemical compound having a thiol functional group.