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公开(公告)号：AU2020271227A1
公开(公告)日：2021-10-14
申请号：AU2020271227
申请日：2020-04-06
Applicant: IBM
Inventor： ADIGA VIVEKANANDA , SANDBERG MARTIN , CHOW JERRY , PAIK HANHEE
Abstract: A qubit includes a substrate, and a first capacitor structure having a lower portion formed on a surface of the substrate and at least one first raised portion extending above the surface of the substrate. The qubit further includes a second capacitor structure having a lower portion formed on the surface of the substrate and at least one second raised portion extending above the surface of the substrate. The first capacitor structure and the second capacitor structure are formed of a superconducting material. The qubit further includes a junction between the first capacitor structure and the second capacitor structure. The junction is disposed at a predetermined distance from the surface of the substrate and has a first end in contact with the first raised portion and a second end in contact with the second raised portion.
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公开(公告)号：AU2020381881A1
公开(公告)日：2022-05-12
申请号：AU2020381881
申请日：2020-11-13
Applicant: IBM
Inventor： ADIGA VIVEKANANDA , SANDBERG MARTIN , RATH DAVID
Abstract: A method of making a Josephson junction in a superconducting qubit includes providing a substrate (100) having a convex structure with a first face (402A) and a second face (402B) meeting at an edge (402C), depositing a first layer of superconducting material (502A) on the first face, oxidizing the first layer to form a layer of oxide material (504A) on a surface of the first layer, and depositing a second layer of the superconducting material (506A) on the second face. A portion of the second layer is in contact with a portion of the layer of oxide material at or in the vicinity of the edge such that the portion of the layer of oxide material is sandwiched between a portion of the first layer and the portion of the second layer to define the Josephson junction at or in the vicinity of the edge.
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公开(公告)号：IL286610D0
公开(公告)日：2021-10-31
申请号：IL28661021
申请日：2021-09-22
Applicant: IBM , SANDBERG MARTIN , ADIGA VIVEKANANDA , TOPALOGLU RASIT ONUR
Inventor： SANDBERG MARTIN , ADIGA VIVEKANANDA , TOPALOGLU RASIT ONUR
Abstract: A fluxonium qubit includes a superinductor. The superinductor includes a substrate, and a first vertical stack extending in a vertical direction from a surface of the substrate. The first vertical stack includes a first Josephson junction and a second Josephson junction connected in series along the vertical direction. The superinductor includes a second vertical stack extending in a vertical direction from a surface of the substrate. The second vertical stack includes a third Josephson junction. The superinductor includes a superconducting connector connecting the first and second vertical stacks in series such that the first, second, and third Josephson junctions are connected in series. The fluxonium qubit further includes a shunted Josephson junction connected to the superinductor with superconducting wires such that the first, second, and third Josephson junctions of the superinductor that are in series are connected in parallel with the shunted Josephson junction.
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公开(公告)号：DE112018006053B4
公开(公告)日：2021-11-11
申请号：DE112018006053
申请日：2018-11-09
Applicant: IBM
Inventor： ROSENBLATT SAMI , ORCUTT JASON , SANDBERG MARTIN , BRINK MARKUS , ADIGA VIVEKANANDA , BRONN NICHOLAS TORLEIV
Abstract: Verfahren zum Bilden einer Quantenbit(Qubit)-Flip-Chip-Baugruppe, wobei das Verfahren aufweist:Bilden eines Qubit auf einem ersten Chip;Bilden eines optisch durchlässigen Wegs in einem zweiten Chip; undBonden des ersten Chips an den zweiten Chip; undwobei der optisch durchlässige Weg oberhalb des Qubit angeordnet ist,wobei der Weg eine Öffnung mit einem Durchmesser aufweist, der groß genug ist, um eine Behandlung des Qubit zu ermöglichen.
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公开(公告)号：AU2020260301A1
公开(公告)日：2021-09-30
申请号：AU2020260301
申请日：2020-03-25
Applicant: IBM
Inventor： SANDBERG MARTIN , ADIGA VIVEKANANDA , TOPALOGLU RASIT ONUR
Abstract: A fluxonium qubit includes (400) a superinductor (402). The superinductor includes a substrate (404), and a first vertical stack (406) extending in a vertical direction from a surface (406) of the substrate (404). The first vertical stack includes a first Josephson junction (410) and a second Josephson junction (412) connected in series along the vertical direction. The superinductor includes a second vertical stack (414) extending in a vertical direction from a surface of the substrate. The second vertical stack includes a third Josephson junction (416). The superinductor includes a superconducting connector (420) connecting the first and second vertical stacks in series such that the first, second, and third Josephson junctions are connected in series. The fluxonium qubit further includes a shunted Josephson junction (422) connected to the superinductor with superconducting wires (424, 426) such that the first, second, and third Josephson junctions of the superinductor that are in series are connected in parallel with the shunted Josephson junction.
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Patent Agency Ranking
公开(公告)号：CA3137255A1
公开(公告)日：2020-10-22
申请号：CA3137255
申请日：2020-03-25
Applicant: IBM
Inventor： SANDBERG MARTIN , ADIGA VIVEKANANDA , TOPALOGLU RASIT ONUR
Abstract: A fluxonium qubit includes (400) a superinductor (402). The superinductor includes a substrate (404), and a first vertical stack (406) extending in a vertical direction from a surface (406) of the substrate (404). The first vertical stack includes a first Josephson junction (410) and a second Josephson junction (412) connected in series along the vertical direction. The superinductor includes a second vertical stack (414) extending in a vertical direction from a surface of the substrate. The second vertical stack includes a third Josephson junction (416). The superinductor includes a superconducting connector (420) connecting the first and second vertical stacks in series such that the first, second, and third Josephson junctions are connected in series. The fluxonium qubit further includes a shunted Josephson junction (422) connected to the superinductor with superconducting wires (424, 426) such that the first, second, and third Josephson junctions of the superinductor that are in series are connected in parallel with the shunted Josephson junction.
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公开(公告)号：CA3136508A1
公开(公告)日：2020-10-15
申请号：CA3136508
申请日：2020-04-06
Applicant: IBM
Inventor： ADIGA VIVEKANANDA , SANDBERG MARTIN , CHOW JERRY , PAIK HANHEE
Abstract: A qubit includes a substrate, and a first capacitor structure having a lower portion formed on a surface of the substrate and at least one first raised portion extending above the surface of the substrate. The qubit further includes a second capacitor structure having a lower portion formed on the surface of the substrate and at least one second raised portion extending above the surface of the substrate. The first capacitor structure and the second capacitor structure are formed of a superconducting material. The qubit further includes a junction between the first capacitor structure and the second capacitor structure. The junction is disposed at a predetermined distance from the surface of the substrate and has a first end in contact with the first raised portion and a second end in contact with the second raised portion.
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公开(公告)号：AU2021294859A1
公开(公告)日：2022-11-17
申请号：AU2021294859
申请日：2021-06-17
Applicant: IBM
Inventor： GILL DOUGLAS , SANDBERG MARTIN , ADIGA VIVEKANANDA , MARTIN YVES , PAIK HANHEE
Abstract: A method for improving lifetime and coherence time of a qubit in a quantum mechanical device includes providing a substrate having at least one qubit formed on the frontside, the at least one qubit having capacitor pads, and removing substrate material from the backside at an area opposite the qubit and/or depositing a superconducting metal layer at the backside area opposite the qubit to reduce radiofrequency electrical current loss due to at least one of silicon-air (SA) interface, metal-air (MA) interface or silicon-metal (SM) interface.
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公开(公告)号：AU2020399936A1
公开(公告)日：2022-05-26
申请号：AU2020399936
申请日：2020-12-07
Applicant: IBM
Inventor： ADIGA VIVEKANANDA , SANDBERG MARTIN , SOLGUN FIRAT , CHOW JERRY
Abstract: Devices, systems, methods, computer-implemented methods, apparatus, and/or computer program products that can facilitate a switch device that shifts frequency of a resonator in a quantum device are provided. According to an embodiment, a device (102) comprises a readout resonator (104) coupled to a qubit. The device can further comprise a switch device (108) formed across the readout resonator that shifts frequency of the readout resonator based on position of the switch device. According to another embodiment, a device comprises a bus resonator coupled to a plurality of qubits. The device can further comprise a switch device formed across the bus resonator that shifts frequency of the bus resonator based on position of the switch device.
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公开(公告)号：IL286615D0
公开(公告)日：2021-10-31
申请号：IL28661521
申请日：2021-09-22
Applicant: IBM , ADIGA VIVEKANANDA , SANDBERG MARTIN , CHOW JERRY , PAIK HANHEE
Inventor： ADIGA VIVEKANANDA , SANDBERG MARTIN , CHOW JERRY , PAIK HANHEE
Abstract: A qubit includes a substrate, and a first capacitor structure having a lower portion formed on a surface of the substrate and at least one first raised portion extending above the surface of the substrate. The qubit further includes a second capacitor structure having a lower portion formed on the surface of the substrate and at least one second raised portion extending above the surface of the substrate. The first capacitor structure and the second capacitor structure are formed of a superconducting material. The qubit further includes a junction between the first capacitor structure and the second capacitor structure. The junction is disposed at a predetermined distance from the surface of the substrate and has a first end in contact with the first raised portion and a second end in contact with the second raised portion.
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