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公开(公告)号：DE69105684T2
公开(公告)日：1995-05-24
申请号：DE69105684
申请日：1991-09-04
Applicant: IBM
Inventor： HAYDEN TERRY F , HICKS CHRISTOPHER A , LEDERMANN PETER G , NGUYEN ALVIN D , STEINBACH STEPHEN C , YU STANLEY K
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Patent Agency Ranking
公开(公告)号：CA1259425A
公开(公告)日：1989-09-12
申请号：CA532515
申请日：1987-03-19
Applicant: IBM
Inventor： HODGSON RODNEY T , JONES HARRY J , LEDERMANN PETER G , MOSKOWITZ PAUL A , REILEY TIMOTHY C
IPC: H01L21/60 , H01L23/485 , H01L23/538 , H05K3/40 , H01L23/28
Abstract: Automated bonding of chips to tape and formation of bonding structures on Tape Automated Bonding (TAB) packaging structures are provided with bonding balls on the ends of beams leads of the TAB tape. Also balltape bonding balls are aligned on stacked TAB sheets and bonded together to form via interconnections through stacked balltape balls in multilayer, electronic packaging structures. Interconnection structures are provided for a universal chip connection laminate which can be applied between a chip and an MLC package. Area TAB tape, which comprises a modification of TAB tape provides balltape TAB connections by means of balltape bonds to areas within the interior of a chip whose leads are bonded in a TAB tape arrangement to the Inner Lead Bonds of the area tape.
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公开(公告)号：DE68918380D1
公开(公告)日：1994-10-27
申请号：DE68918380
申请日：1989-07-12
Applicant: IBM
Inventor： ARLDT BRIAN D , BRUHN PETER H , BULLER LAWRENCE M , LEDERMANN PETER G , LINAM STEPHEN D , MCNELIS BARBARA J , MOK LAWRENCE S , MOSKOWITZ PAUL A
Abstract: An integrated circuit chip package is described wherein the chip (18) has an active face including a plurality of input and output pads (30). The chip is mounted face down on a plurality of flexible inner beam leads. The package's outer beam leads are bonded to pads residing on an underlying circuit board (26). A convective heat sink (32) is thermally mounted to the reverse face of the chip, which heat sink is formed from folded thin metal sheet. The heat sink exhibits both minimum mass, and optimum cooling efficiency. The minimum mass reduces the cost of the heat sink through material savings and minimizes the possibility of damage to the package caused by sudden accelerations. The heat sink, in addition to itself being somewhat flexible, is provided with mounting points (60) which are physically connected to the underlying circuit board via resilient connecting means.
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公开(公告)号：DE68918380T2
公开(公告)日：1995-03-30
申请号：DE68918380
申请日：1989-07-12
Applicant: IBM
Inventor： ARLDT BRIAN D , BRUHN PETER H , BULLER LAWRENCE M , LEDERMANN PETER G , LINAM STEPHEN D , MCNELIS BARBARA J , MOK LAWRENCE S , MOSKOWITZ PAUL A
Abstract: An integrated circuit chip package is described wherein the chip (18) has an active face including a plurality of input and output pads (30). The chip is mounted face down on a plurality of flexible inner beam leads. The package's outer beam leads are bonded to pads residing on an underlying circuit board (26). A convective heat sink (32) is thermally mounted to the reverse face of the chip, which heat sink is formed from folded thin metal sheet. The heat sink exhibits both minimum mass, and optimum cooling efficiency. The minimum mass reduces the cost of the heat sink through material savings and minimizes the possibility of damage to the package caused by sudden accelerations. The heat sink, in addition to itself being somewhat flexible, is provided with mounting points (60) which are physically connected to the underlying circuit board via resilient connecting means.
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公开(公告)号：DE69105684D1
公开(公告)日：1995-01-19
申请号：DE69105684
申请日：1991-09-04
Applicant: IBM
Inventor： HAYDEN TERRY F , HICKS CHRISTOPHER A , LEDERMANN PETER G , NGUYEN ALVIN D , STEINBACH STEPHEN C , YU STANLEY K
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公开(公告)号：BR8701658A
公开(公告)日：1988-01-26
申请号：BR8701658
申请日：1987-04-08
Applicant: IBM
Inventor： HODGSON RODNEY TREVOR , JONES HARRY J , LEDERMANN PETER G , REILEY TIMOTHY C , MOSKOWITZ PAUL ANDREW
IPC: H01L21/60 , H01L23/485 , H01L23/538 , H05K3/40 , H01L21/96 , H01L21/98 , H01L23/02
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