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公开(公告)号:SG85599A1
公开(公告)日:2002-01-15
申请号:SG1998001812
申请日:1998-07-16
Applicant: IBM
Inventor: YASUHIRO MITA , TATSUSHI YOSHIDA , HIROMI ISHIKAWA , TATSUYA TANAKA , HIROYASU TSU CHIDA , TAKUYA SATOH
Abstract: A head support arm of a disk drive device comprises; a front portion supporting a head/slider assembly, a rear portion pivotally mounted on a frame of the disk drive device, a bending portion between the front portion and the rear portion, a plurality of electrically conductive wires covered by a tube, and a first fixing position and a second fixing position symmetrically located on both sides of a center line of the head support arm at positions between the bending portion and the front portion, characterized in that the tube is attached to the head support arm between the bending portion and the rear portion, the plurality of electrically conductive wires extending from a front end of the tube on the side of the front portion of the head support arm extend over the bending portion and are divided into a first group and a second group, the first group of wires is fixed to the second fixing position.
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公开(公告)号:SG102642A1
公开(公告)日:2004-03-26
申请号:SG200106752
申请日:2001-11-05
Applicant: IBM
Inventor: TAKAO KIDACHI , TADAAKI TOMIYAMA , YOSHIO UEMATSU , HIROMI ISHIKAWA , TATSUSHI YOSHIDA , HIROYOSHI YOKOME , YUKIHIRO NAKAMURA , HISASHI OHYAMA , TATSUMI TSUCHIYA
Abstract: A method of assembling a head gimbal assembly. The method comprises a series of steps which include: stacking a base plate, a load beam, and a flexure to form a three-layered stacked series with at least a bottom layer being a base plate series; joining portions of the load beam to the base plate, and the flexure to the load beam in the three-layered stacked series to make a suspension section; attaching a slider to the flexure in the suspension section to make a head gimbal assembly; load-bending a hinge portion formed in the head gimbal assembly; and heating the hinge portion in order to adjust a bending load on the hinge portion at a predetermined bending angle to a predetermined value.
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公开(公告)号:SG99312A1
公开(公告)日:2003-10-27
申请号:SG200003686
申请日:2000-07-03
Applicant: IBM
Inventor: TATSUMI TSUCHIYA , TATSUSHI YOSHIDA , HIROYASU TSUCHIDA , HIROO INOUE , SURYA PATTANAIK , HIROMI ISHIKAWA , MASAAKI NANBA
Abstract: Apertures are formed in the portion of a flexure adjacent to the soldered portions between the bonding pads of the slider and the lead pads of lead end portions. With this, an adhesive agent for bonding the slider to a flexure tongue is moved downward from the apertures so there is no fear that the adhesive agent will contact the lead pads and the bonding pads. This design prevents the protrusion of an adhesive agent from short-circuiting the flexure, and absorbs a warp produced by shrinkage of a soldered portion by decreasing rigidity of the flexure. When both the bonding pad formed on the slider and the lead pad of a lead fixed to the platform of the flexure are disposed and soldered, the quality of the soldered portion is improved by locating the pads as close to each other as possible.
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