公开(公告)号：SG91364A1

公开(公告)日：2002-09-17

申请号：SG200103175

申请日：2001-05-25

Applicant: IBM

Inventor： TATSUMI TUCHIYA ,  TATSUSHI YOSHIDA ,  YASUHIRO MITA ,  TADAAKI TOMIYAMA ,  TAKAO KIDACHI ,  SURYA PATTANAIK

IPC: B23K1/005 ,  B23K3/06 ,  B23K31/02 ,  B23K101/42 ,  G11B5/49 ,  H05K3/34 ,  B23K1/00 ,  B23K35/12

Abstract: A capillary tube for a solder ball connection device connects a first connection surface of a pad to a second connection surface of a pad with a solder ball. The first connection surface is formed at a slider held by a slider holder in a disk unit. The second connection surface is formed at an end of a lead wired to the slider holder. The capillary tube has a ball regulator with a substantially conic, hollow portion. The solder ball regulator has an opening at its top that opens to the tip of the hollow portion. The center axes of the hollow portion and the opening are common. The solder ball regulator also has a pair of projections along the center axis around the opening, where the projections face each other with the center axis therebetween. The projections regulate the movement of the solder ball. The tip of the hollow portion is tapered when viewed from a line connecting the pair of projections and the extreme tips of the tapered tip portions.

公开(公告)号：SG99312A1

公开(公告)日：2003-10-27

申请号：SG200003686

申请日：2000-07-03

Applicant: IBM

Inventor： TATSUMI TSUCHIYA ,  TATSUSHI YOSHIDA ,  HIROYASU TSUCHIDA ,  HIROO INOUE ,  SURYA PATTANAIK ,  HIROMI ISHIKAWA ,  MASAAKI NANBA

IPC: G11B21/21 ,  G11B5/48 ,  G11B21/02 ,  G11B5/53

Abstract: Apertures are formed in the portion of a flexure adjacent to the soldered portions between the bonding pads of the slider and the lead pads of lead end portions. With this, an adhesive agent for bonding the slider to a flexure tongue is moved downward from the apertures so there is no fear that the adhesive agent will contact the lead pads and the bonding pads. This design prevents the protrusion of an adhesive agent from short-circuiting the flexure, and absorbs a warp produced by shrinkage of a soldered portion by decreasing rigidity of the flexure. When both the bonding pad formed on the slider and the lead pad of a lead fixed to the platform of the flexure are disposed and soldered, the quality of the soldered portion is improved by locating the pads as close to each other as possible.