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公开(公告)号：DE3276283D1
公开(公告)日：1987-06-11
申请号：DE3276283
申请日：1982-06-29
Applicant: IBM
Inventor： HORVATH JOSEPH LOUIS
IPC: H01L23/36 , H01L23/367 , H01L23/433 , H01L23/42
Abstract: A disk shaped thermal bridge element (24) for use in a semiconductor package to conduct heat from a semicon d uc- tor device (12) to a cold plate (16), which disk element has a bulged shape with a first set of inwardly extending slots (28) and a second set of outwardly extending slots (26) emanating from the center of the disk.
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Patent Agency Ranking
公开(公告)号：DE3374491D1
公开(公告)日：1987-12-17
申请号：DE3374491
申请日：1983-02-08
Applicant: IBM
Inventor： BALDERES DEMETRIOS , HORVATH JOSEPH LOUIS , LIPSCHUTZ LEWIS DRUCKER
IPC: H01L23/44 , F28F3/02 , H01L23/36 , H01L23/433 , H01L23/42
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公开(公告)号：DE68923582T2
公开(公告)日：1996-03-07
申请号：DE68923582
申请日：1989-04-25
Applicant: IBM
IPC: H01L23/473 , H01L23/36 , H01L23/40 , H01L23/433 , H05K7/20
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公开(公告)号：DE68923582D1
公开(公告)日：1995-08-31
申请号：DE68923582
申请日：1989-04-25
Applicant: IBM
IPC: H01L23/473 , H01L23/36 , H01L23/40 , H01L23/433 , H05K7/20
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公开(公告)号：DE3482156D1
公开(公告)日：1990-06-07
申请号：DE3482156
申请日：1984-02-03
Applicant: IBM
Inventor： HORVATH JOSEPH LOUIS
IPC: H01L23/36 , F28F3/02 , H01L23/367 , H01L23/467 , H01L23/46
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公开(公告)号：DE3375348D1
公开(公告)日：1988-02-18
申请号：DE3375348
申请日：1983-04-20
Applicant: IBM
Inventor： HORVATH JOSEPH LOUIS
IPC: H01L23/34 , H01L23/36 , H01L23/433 , H01L23/42
Abstract: A thermal bridge element for use in a semiconductor package to conduct heat from a semiconductor device (12) to a cold plate of cover (16) positioned in close proximity. The bridge element (24) has an axially compressible spring (26) with a bulged central portion, a first flat plate adapted to be placed in contact with the device, a second flat plate adapted to be disposed in contact with the cold plate or cover, and means (32,34;44) to maintain the spring, the first plate, and the second plate in operative engagement.
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