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公开(公告)号：DE3475142D1
公开(公告)日：1988-12-15
申请号：DE3475142
申请日：1984-05-23
Applicant: IBM
IPC: H01L23/36 , H01L23/367 , H01L23/40
Abstract: A heat sink structure for mounting on a semiconductor package includes a plurality of pins (20) affixed to a lid on the package (12-16), and a cooling fin means (26) having a thin walled, cellular configuration with the cells defining parallel elongated openings that extend through the fin means. The pins (20) are seated in the cells of the fin means.
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公开(公告)号：DE3855436D1
公开(公告)日：1996-08-29
申请号：DE3855436
申请日：1988-04-28
Applicant: IBM
Inventor： BLAKE BRUCE EDWARD , HULTMARK ERIC BRUCE , PRESTI FANK PATRICK , RICCI RAYMOND , RIPPENS ROGER ALAN
IPC: H01L23/52 , G06F1/18 , H01L23/44 , H01L23/538 , H05K1/02 , H05K1/03 , H05K1/14 , H05K3/34 , H05K7/02 , H05K7/20 , H01L23/36
Abstract: A ceramic card assembly which provides high density three dimensional semiconductor device packaging and overcomes the power distribution and thermal management problems that have impaired prior ceramic cards. The ceramic card assembly combines ceramic cards with flexible power distribution structures which provide low inductance and low resistance power distribution, making ceramic cards available for for high performance VLSI systems. Each ceramic card assembly comprises a ceramic card having a plurality of chip sites and power contacts thereon, and at least one flexible power distribution structure having alternating insulation (i.e. polyimide) layers and conductor (i.e., copper) layers, the flexible power distribution structures are mounted adjacent to the ceramic cards so that conductive layers of the ceramic cards are selectively exposed to the power contacts. The ceramic card assemblies are preferably combined into a field replaceable unit that includes cold plates between ceramic cards. High density packages further include ceramic in line packages which quadruple current day memory density.
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