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公开(公告)号：DE3475142D1
公开(公告)日：1988-12-15
申请号：DE3475142
申请日：1984-05-23
Applicant: IBM
IPC: H01L23/36 , H01L23/367 , H01L23/40
Abstract: A heat sink structure for mounting on a semiconductor package includes a plurality of pins (20) affixed to a lid on the package (12-16), and a cooling fin means (26) having a thin walled, cellular configuration with the cells defining parallel elongated openings that extend through the fin means. The pins (20) are seated in the cells of the fin means.
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