公开(公告)号：MY125344A

公开(公告)日：2006-07-31

申请号：MYPI20003159

申请日：2000-07-10

Applicant: IBM

Inventor： KONSTANTINOS I PAPATHOMAS ,  STEPEHN LESLIE BUCHWALTER ,  HUNG MANH DANG ,  MICHAEL ANTHONY GAYNES

IPC: H01L23/48 ,  H01L23/31 ,  H01L23/433 ,  H01L23/52

Abstract: AN ELECTRONIC STRUCTURE BONDABLE TO AN ELECTRONIC ASSEMBLY, SUCH AS CHIP.THE ELECTRONIC STRUCTURE MAY BE JOINED TO A ELECTRONIC ASSEMBLY, SUCH AS CHIP, BY USE OF A STRUCTURAL EPOXY ADHESIVE. THE ELECTRONIC STRUCTURE INCLUDES A MINERAL LAYER ON A METALLIC PLATE, AND AN ADHESION PROMOTER LAYER ON THE MINERAL LAYER. THE METALLIC PLATE INCLUDES A METALLIC SUBTANCE THAT INCLUDES A PURE METAL WITH OR WITHOUT A METAL COATING. THE METALLIC SUBTANCE MAY INCLUDE SUCH SUBTANCES AS STAINLESS STEEL,ALUMINIUM,TITANIUM,COPPER,COPPER COATED WITH NICKEL,AND COPPER COATED WITH CHROME. THE MINERAL LAYER INCLUDES A CHEMICAL COMPOUND DERIVED FROM A MINERAL; E.G.,SILICON(SIO?) DERIVED FROM QUARTZ. SUCH CHEMICAL COMPOUNDS MAY INCLUDE SUCH SUBTANCES AS SILICON DIOXIDE, SILICON NITRIDE, AND SILICON CARBIDE. THE CHEMICAL COMPOUND MAY EXIST IN EITHER CRYSTALLINE AMORPHOUS FORM. THE ADHESION PROMOTER MAY INCLUDE SUCH CHEMICAL SUBTANCES AS SILANES, TITANATES, ZIRCONATES, AND ALUMINATES.(FIGURE 4)

公开(公告)号：SG103264A1

公开(公告)日：2004-04-29

申请号：SG200003983

申请日：2000-07-17

Applicant: IBM

Inventor： STEPHEN LESLIE BUCHWALTER ,  HUNG MANH DANG ,  MICHAEL A GAYNES ,  KONSTANTINOS I PAPATHOMAS

IPC: H01L23/31 ,  H01L23/433 ,  H01L23/48

Abstract: An electronic structure bondable to an electronic assembly, such as a chip. The electronic structure may be joined to a electronic assembly, such as a chip, by use of a structural epoxy adhesive. The electronic structure includes a mineral layer on a metallic plate, and an adhesion promoter layer on the mineral layer. The metallic plate includes a metallic substance that includes a pure metal with or without a metal coating. The metallic substance may include such substances as stainless steel, aluminum, titanium, copper, copper coated with nickel, and copper coated with chrome. The mineral layer includes a chemical compound derived from a mineral; e.g., silicon dioxide (SiO 2 ) derived from quartz. Such chemical compounds may include such substances as silicon dioxide, silicon nitride, and silicon carbide. The chemical compound may exist in either crystalline or amorphous form. The adhesion promoter may include such chemical substances as silanes, titanates, zirconates, and aluminates.